Principal/Staff/Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Micron Technology, Inc; Singapore; On-site; SGD 110,000 - 170,000; Full time

Benefits offered by this job

No perks listed

Job summary

Micron Technology, Inc. is seeking a Principal/Staff/Senior Engineer within APTD CEM – Advanced Packaging Wafer Level Technology Engineering.

You will develop and deploy wafer finishing processes, optimize capabilities, and collaborate with cross‑functional teams to ensure smooth tech transfers from development to high‑volume production. The role requires strong data analytics, experience in semiconductor processing, and proficiency in Python, R, SQL and automation tools.

Qualifications

• B.S./M.S./Ph.D. in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related fields.
• 2+ years of semiconductor process development experience, preferably in wafer bonding, plating, warpage control, and packaging.
• Proficiency in Python, R, SQL for statistics, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC, and RMS for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

Responsibilities

• Develop and enable deployment of processes related to post‑fab wafer finishing (wafer thinning, backside metal interconnect).
• Upgrade process capabilities and reduce production costs.
• Establish and improve process management projects to deliver technology node requirements and scaling for the next node.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Set up process parameters for various semiconductor equipment.
• Ensure defense coverage through process, measurement, inspection, and testing.

Skills

Python

R

SQL

Visual Basic for automation

Data analytics

Education

B.S./M.S./Ph.D. in Chemical Engineering / Electrical Engineering / Mechanical Engineering / Physics

Tools

E3

FDC

RMS

Job description

Micron Technology is a world leader in memory and storage solutions. The role is Principal/Staff/Senior Engineer within APTD CEM – Advanced Packaging Wafer Level Technology Engineering.

Key Responsibilities

• Develop and enable deployment of processes related to post‑fab wafer finishing (wafer thinning, backside metal interconnect).
• Upgrade process capabilities and reduce production costs.
• Establish and improve process management projects to deliver technology node requirements and scaling for the next node.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Set up process parameters for a variety of semiconductor equipment.
• Ensure defense coverage through process, measurement, inspection, and testing.
• Establish correlations between defense mechanisms to identify improvement opportunities.
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives.
• Collaborate with Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality teams to integrate manufacturing processes for optimal performance and quality control.
• Ensure smooth transition from new product development, qualification, small‑volume production to high‑volume production.
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production high‑volume manufacturing fabrication facilities.
• Contribute to a culture of continuous improvement by identifying, testing, and sharing AI‑enabled enhancements within one's scope of work.

Requirements

• B.S./M.S./Ph.D. (or equivalent) in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related technical fields.
• At least 2 years of semiconductor process development experience, preferably in wafer bonding, plating, warpage control, and packaging.
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC, and RMS for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
• Strong understanding of process flows, interactions, and impact of changes on yield, performance, and reliability.
• Tenacity to work effectively under timelines and limited resources.
• Consistent track record of solving problems and addressing root causes.

EEO Statement

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.