Principal Scientist, Temporary Wafer Bonding & Debonding

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore seeks a Research Scientist to advance temporary wafer bonding and debonding technologies for 3D ICs and advanced packaging.

You will design and optimize TBDB processes, run DOE studies to improve yield and reliability, and collaborate with design, equipment, and reliability teams. The role involves wafer characterization with metrology and contributing to patents and publications.

Qualifications

• Ph.D. in a relevant discipline with strong research track record.
• Hands-on semiconductor process development in cleanroom settings.
• Experience with temporary bonding, wafer bonding or related modules is preferred.
• Strong analytical and problem-solving skills with DOE experience.

Responsibilities

• Develop and optimize TBDB processes for advanced semiconductor packaging.
• Design and execute DOE to improve process capability, yield and reliability.
• Develop solutions for thin-wafer handling, layer transfer, debonding and warpage control.
• Investigate process challenges via root-cause analysis and implement corrective actions.
• Collaborate with design, integration, equipment, and reliability teams.
• Collaborate with vendors to qualify bonding materials, carriers, and equipment.
• Perform wafer characterization using advanced metrology and failure analysis.
• Analyse data, establish process control methods, and document results.
• Contribute to patents, publications, and collaborations with partners.

Skills

DOE (Design of Experiments)

Statistical data analysis

Semiconductor process development

Teamwork & communication

Education

Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related discipline

Tools

Bonding equipment

Metrology equipment

Job description

A*STAR - Agency for Science, Technology and Research in Singapore seeks a Research Scientist to advance temporary wafer bonding and debonding technologies for 3D ICs and advanced packaging.

You will design and optimize TBDB processes, run DOE studies to improve yield and reliability, and collaborate with design, equipment, and reliability teams. The role involves wafer characterization with metrology and contributing to patents and publications.