Senior Scientist - Temporary Wafer Bonding & 3D Packaging

A*STAR - Agency for Science, Technology and Research

Singapore

On-site

SGD 90,000 - 150,000

Full time

14 days+

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Job summary

A*STAR - Agency for Science, Technology and Research in Singapore invites applications for a Research Scientist – Temporary Wafer Bonding & Debonding (R&D). The role focuses on developing TBDB technologies for 3D ICs and advanced semiconductor packaging.

The successful candidate will design DOE studies, optimize processes, collaborate across disciplines, and contribute to patents and publications. This position is based in Singapore and involves close collaboration with industry and academic

Qualifications

PhD in a relevant field with strong research background.
Hands-on semiconductor process development in a cleanroom.
Experience in TBDB, wafer bonding or related modules preferred; fresh PhDs welcome.
Strong analytical and problem-solving skills with DOE and data analysis experience.
Self-motivated team player with excellent communication and teamwork skills.

Responsibilities

Develop and optimize TBDB processes for advanced semiconductor packaging.
Design and execute DOE to improve process capability, yield, and reliability.
Develop solutions for thin-wafer handling, layer transfer, debonding, cleaning, and warpage control.
Investigate process challenges through root‑cause analysis and implement corrective actions.
Collaborate with design, integration, equipment, and reliability teams to develop robust solutions.
Collaborate with vendors to evaluate and qualify bonding materials, carrier systems, and equipment.
Perform wafer characterization using advanced metrology and failure analysis techniques.
Analyse process data, establish process control methods, and document results.
Contribute to technology innovation through patents, publications, and external collaborations.