Principal Scientist I, Process Modules, APM, IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore seeks a Research Scientist to advance temporary wafer bonding and debonding technologies for 3D ICs and advanced packaging.

You will design and optimize TBDB processes, run DOE studies to improve yield and reliability, and collaborate with design, equipment, and reliability teams. The role involves wafer characterization with metrology and contributing to patents and publications.

Qualifications

• Ph.D. in a relevant discipline with strong research track record.
• Hands-on semiconductor process development in cleanroom settings.
• Experience with temporary bonding, wafer bonding or related modules is preferred.
• Strong analytical and problem-solving skills with DOE experience.

Responsibilities

• Develop and optimize TBDB processes for advanced semiconductor packaging.
• Design and execute DOE to improve process capability, yield and reliability.
• Develop solutions for thin-wafer handling, layer transfer, debonding and warpage control.
• Investigate process challenges via root-cause analysis and implement corrective actions.
• Collaborate with design, integration, equipment, and reliability teams.
• Collaborate with vendors to qualify bonding materials, carriers, and equipment.
• Perform wafer characterization using advanced metrology and failure analysis.
• Analyse data, establish process control methods, and document results.
• Contribute to patents, publications, and collaborations with partners.

Skills

DOE (Design of Experiments)

Statistical data analysis

Semiconductor process development

Teamwork & communication

Education

Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related discipline

Tools

Bonding equipment

Metrology equipment

Job description

Research Scientist – Temporary Wafer Bonding & Debonding (R&D)

We are seeking a passionate and innovative Research Scientist to join our multidisciplinary R&D team to develop temporary wafer bonding and debonding (TBDB) technologies for next-generation semiconductor packaging. This is an exciting opportunity to work on enabling technologies for 3D ICs, chiplets, heterogeneous integration, and wafer-level packaging, transforming research ideas into robust manufacturing solutions.

Key Responsibilities

• Develop and optimize temporary wafer bonding and debonding processes for advanced semiconductor packaging.
• Design and execute DOE to improve process capability, yield, and reliability.
• Develop solutions for thin-wafer handling, layer transfer, debonding, cleaning, and warpage control.
• Investigate process challenges through systematic root-cause analysis and implement corrective actions.
• Collaborate with design, integration, equipment, and reliability teams to develop robust process solutions.
• Collaborate with vendor to evaluate and qualify new bonding materials, carrier systems, and equipment.
• Perform wafer characterization using advanced metrology and failure analysis techniques.
• Analyse process data, establish process control methods, and document technical results.
• Contribute to technology innovation through patents, publications, and collaboration with internal and external partners.

Qualifications

• Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related discipline.
• Hands-on experience in semiconductor process development within a cleanroom environment.
• Experience in temporary bonding, wafer bonding, advanced packaging, thin-wafer processing, semiconductor assembly, or related process modules is preferred. Fresh Ph.D. graduates with strong research interest are welcome to apply.
• Strong analytical and problem-solving skills with experience in DOE and statistical data analysis.
• Self-motivated team player with excellent communication and teamwork skills with a passion for developing innovative semiconductor technologies.