Lead Bonding Process Engineer – Wafer-Level 3D Integration

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore is looking for a Bonding Process Control Engineer to optimize and sustain wafer-level bonding processes. The role focuses on process stability, yield improvement, and collaborating with cross-functional teams. The ideal candidate has a Bachelor’s degree in relevant engineering fields and at least 3 years of hands-on experience. Familiarity with SPC and advanced packaging is essential, making this an exciting opportunity to contribute to next-generation technologies.

Qualifications

• 3+ years of hands-on experience in wafer bonding and advanced packaging.
• Strong command of SPC and statistical data analysis.
• Understanding of 3DIC and advanced packaging process flows.

Responsibilities

• Own and maintain SPC control strategies for bonding processes.
• Drive yield enhancement through data analytics and statistical modeling.
• Collaborate with cross-functional teams for product ramps.

Skills

Hands-on experience in wafer bonding

SPC

Statistical modeling

Problem-solving frameworks

Education

Bachelor's degree in Materials Science, Chemical, Mechanical or Electrical Engineering

Tools

Bonding tools

Metrology equipment

Job description

A*STAR - Agency for Science, Technology and Research in Singapore is looking for a Bonding Process Control Engineer to optimize and sustain wafer-level bonding processes. The role focuses on process stability, yield improvement, and collaborating with cross-functional teams. The ideal candidate has a Bachelor’s degree in relevant engineering fields and at least 3 years of hands-on experience. Familiarity with SPC and advanced packaging is essential, making this an exciting opportunity to contribute to next-generation technologies.