Principal Scientist I, Process Modules, APM, IME

A*STAR RESEARCH ENTITIES; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

A*STAR RESEARCH ENTITIES invites applications for a Research Scientist - Temporary Wafer Bonding & Debonding (R&D) to join our multidisciplinary team in Singapore. The role focuses on developing TBDB technologies for 3D ICs and advanced packaging, transforming research ideas into scalable manufacturing solutions.

You will lead DOE studies, optimize bonding and debonding processes, collaborate with design, equipment and reliability groups, and contribute to patents, publications, and partnerships

Qualifications

• Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related discipline with at least 8 years of relevant experience.
• Hands-on experience in semiconductor process development within a cleanroom environment.
• Experience in temporary bonding, wafer bonding, advanced packaging, thin-wafer processing, semiconductor assembly, or related process modules is preferred.
• Strong analytical and problem-solving skills with experience in DOE and statistical data analysis.

Responsibilities

• Develop and optimize temporary wafer bonding and debonding processes for advanced semiconductor packaging.
• Design and execute DOE to improve process capability, yield, and reliability.
• Develop solutions for thin-wafer handling, layer transfer, debonding, cleaning, and warpage control.
• Investigate process challenges through systematic root-cause analysis and implement corrective actions.
• Collaborate with design, integration, equipment, and reliability teams to develop robust process solutions.
• Collaborate with vendor to evaluate and qualify new bonding materials, carrier systems, and equipment.
• Perform wafer characterization using advanced metrology and failure analysis techniques.
• Analyse process data, establish process control methods, and document technical results.
• Contribute to technology innovation through patents, publications, and collaboration with internal and external partners.

Skills

DOE design of experiments

Statistical data analysis

Analytical problem solving

Team collaboration

Communication

Education

Ph.D. in Materials Science or related

8+ years relevant experience

Job description

Research Scientist - Temporary Wafer Bonding & Debonding (R&D)

We are seeking a passionate and innovative Research Scientist to join our multidisciplinary R&D team to develop temporary wafer bonding and debonding (TBDB) technologies for next-generation semiconductor packaging. This is an exciting opportunity to work on enabling technologies for 3D ICs, chiplets, heterogeneous integration, and wafer-level packaging, transforming research ideas into robust manufacturing solutions.

Key Responsibilities

• Develop and optimize temporary wafer bonding and debonding processes for advanced semiconductor packaging.
• Design and execute DOE to improve process capability, yield, and reliability.
• Develop solutions for thin-wafer handling, layer transfer, debonding, cleaning, and warpage control.
• Investigate process challenges through systematic root-cause analysis and implement corrective actions.
• Collaborate with design, integration, equipment, and reliability teams to develop robust process solutions.
• Collaborate with vendor to evaluate and qualify new bonding materials, carrier systems, and equipment.
• Perform wafer characterization using advanced metrology and failure analysis techniques.
• Analyse process data, establish process control methods, and document technical results.
• Contribute to technology innovation through patents, publications, and collaboration with internal and external partners.

Qualifications

• Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related discipline with at least 8 years of relevant experience.
• Hands-on experience in semiconductor process development within a cleanroom environment.
• Experience in temporary bonding, wafer bonding, advanced packaging, thin-wafer processing, semiconductor assembly, or related process modules is preferred. Fresh Ph.D. graduates with strong research interest are welcome to apply.
• Strong analytical and problem-solving skills with experience in DOE and statistical data analysis.
• Self-motivated team player with excellent communication and teamwork skills with a passion for developing innovative semiconductor technologies.

The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.