TBDB Research Engineer – Wafer-Level Packaging

A*STAR - Agency for Science, Technology and Research; Singapore; Vor Ort; SGD 60.000 - 80.000; Vollzeit

Zusammenfassung

A*STAR - Agency for Science, Technology and Research in Singapore is looking for a Research Engineer specializing in Wafer-to-Wafer Bonding. In this role, you will develop and optimize processes essential for advanced semiconductor packaging, especially with ultra-thin wafers. Candidates should have a Bachelor's degree in relevant fields and experience in TBDB process development is a plus. Strong analytical skills, problem-solving abilities, and teamwork are essential for success in this position.

Qualifikationen

• Experience in TBDB process development or advanced packaging technologies is an advantage.
• Ability to work in a cleanroom environment and handle precision equipment.

Aufgaben

• Develop and optimize temporary bonding and debonding processes for wafer-level packaging.
• Support integration of process flows for compatibility in advanced packaging.
• Investigate and resolve process issues such as voids, warpage, and delamination.

Kenntnisse

Analytical skills

Problem-solving abilities

Good communication

Teamwork

Ausbildung

Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering

Jobbeschreibung

A*STAR - Agency for Science, Technology and Research in Singapore is looking for a Research Engineer specializing in Wafer-to-Wafer Bonding. In this role, you will develop and optimize processes essential for advanced semiconductor packaging, especially with ultra-thin wafers. Candidates should have a Bachelor's degree in relevant fields and experience in TBDB process development is a plus. Strong analytical skills, problem-solving abilities, and teamwork are essential for success in this position.