Principal Engineer: 3D NAND & CMP Innovation Lead

Micron Technology, Inc.; Singapore; On-site; SGD 120,000 - 170,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an experienced CMP Process Development Engineer to advance chemical mechanical planarization for the next generation of 3D NAND memory.

You will optimize CMP procedures, improve margins, and collaborate with process integration teams across Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch to meet yield goals. You will also initiate experiments, work with vendors, and contribute to strategy for N+, N++, and future NAND nodes while mentoring

Qualifications

• Must have Masters/PhD with 5–10 years or Bachelor’s with 7–12 years in semiconductors.
• Background in CMP Process in 300mm wafer fabrication.
• Hands-on CMP equipment operation knowledge (AMAT LKP, EBARA-300X).

Responsibilities

• Develop and optimize CMP procedures to improve product quality and yield.
• Lead innovative CMP process development for 3D NAND memory.
• Collaborate with vendors to meet integration requirements for next-gen NAND nodes.
• Design and implement advanced process monitoring and control methodologies.
• Mentor new hires and engage with global teams.

Skills

CMP process

Teamwork

Communication

AI literacy

Analytical thinking

Education

MS/PhD

Bachelor's

Tools

AMAT LKP

EBARA-300X

Optical metrology

Profilometry

Job description

Micron Technology, Inc. in Singapore is seeking an experienced CMP Process Development Engineer to advance chemical mechanical planarization for the next generation of 3D NAND memory.

You will optimize CMP procedures, improve margins, and collaborate with process integration teams across Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch to meet yield goals. You will also initiate experiments, work with vendors, and contribute to strategy for N+, N++, and future NAND nodes while mentoring