Lead CMP Engineer – 3D NAND & Process Innovation

Micron Technology, Inc.; Singapore; On-site; SGD 140,000 - 220,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Staff Engineer to advance CMP for next-generation 3D NAND. You will develop and optimize CMP process flows, work with cross-functional teams, and drive innovations from lab to production while maintaining IP and quality standards.

The role requires a Master/ PhD or equivalent with 5–12 years in CMP, strong hands-on equipment experience (AMAT LKP, EBARA-300X), and excellent communication to partner with global teams.

Qualifications

• Hands-on CMP equipment operation experience including AMAT LKP and EBARA-300X.
• Experience in CMP development for 3D NAND or memory tech.
• Understanding of film deposition and upstream/downstream constraints.
• Strong communication and collaboration across global teams.

Responsibilities

• Develop and optimize CMP procedures to improve product quality and yield.
• Advance process margins to meet mature yield goals for 3D NAND.
• Lead experiments, evaluate manufacturability of next nodes, and monitor tooling.
• Collaborate with vendors to meet integration requirements for next-gen nodes.
• Design advanced process monitoring and contribute to strategic roadmaps.

Skills

CMP equipment operation

Optical metrology

Profilometry

Polishing slurries

Polishing pads

Dielectrics/ metals CMP

CMP for 3D NAND

Education

Masters/PhD in related field

Bachelor's degree in engineering

Tools

AMAT LKP

EBARA-300X

Job description

Micron Technology, Inc. in Singapore is seeking a Staff Engineer to advance CMP for next-generation 3D NAND. You will develop and optimize CMP process flows, work with cross-functional teams, and drive innovations from lab to production while maintaining IP and quality standards.

The role requires a Master/ PhD or equivalent with 5–12 years in CMP, strong hands-on equipment experience (AMAT LKP, EBARA-300X), and excellent communication to partner with global teams.