Principal Dry Etch Engineer - Next-Gen NAND

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 140,000 - 230,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte Ltd seeks a Staff/Principal Engineer to lead dry etch for Next Generation NAND and drive critical module development. You will collaborate with process integration and other areas, shaping the process roadmap to meet program and yield goals.

You will work on state-of-the-art dry etch chambers, mentor peers, and contribute to a culture of continuous improvement with data-driven insights.

Qualifications

• Masters/PhD in Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors with 4–10 years of dry etch R&D experience.
• Bachelor's degree in a relevant field with 7–12 years of dry etch experience.
• Experience in NAND, DRAM or Logic module development and cross-functional project delivery.

Responsibilities

• Lead dry etch unit process development to meet structural and electrical specifications.
• Collaborate with cross-functional teams to solve complex problems in dry etch.
• Present process and technology roadmaps for current and future technology nodes.
• Mentor peers in dry etch technology and project management.
• Provide critical updates to upper management on project status and impacts.

Skills

Data science basics

Python coding

AI coding

Leadership

Problem solving

Education

Masters/PhD in relevant field

Bachelor's degree in relevant field

Tools

MS Office

SAS JMP

Job description

Micron Semiconductor Asia Operations Pte Ltd seeks a Staff/Principal Engineer to lead dry etch for Next Generation NAND and drive critical module development. You will collaborate with process integration and other areas, shaping the process roadmap to meet program and yield goals.

You will work on state-of-the-art dry etch chambers, mentor peers, and contribute to a culture of continuous improvement with data-driven insights.