Principal CMP Process Engineer, 3D NAND & Innovation

Micron; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

Micron is seeking a Principal Engineer for CMP process development to lead advanced 3D NAND technology programs and cross-functional initiatives. You will drive process characterization, optimization, and transfer to high-volume manufacturing, partnering with global teams and suppliers.

The role requires strong DOE, data analytics, and leadership skills to resolve complex yield and manufacturability challenges while advancing CMP capabilities for future nodes.

Qualifications

• Experience in CMP process development for advanced semiconductor or memory technologies.
• DOE and statistics used for process optimization and data interpretation.
• Leadership of complex technical projects and cross-functional delivery.

Responsibilities

• Lead CMP process characterization and advanced development for 3D NAND and future nodes.
• Define CMP strategies to improve margin, robustness, and manufacturability.
• Lead experiments and data analysis to validate process windows and scaling readiness.
• Drive transfer of CMP processes to high-volume manufacturing and ramp readiness.
• Collaborate with PD, PI, manufacturing, equipment, and suppliers to align CMP solutions.
• Evaluate consumables and equipment to close process capability gaps.

Skills

DOE

Root Cause Analysis

Data Analytics

Technical Leadership

Cross-functional Collaboration

Education

PhD in Electrical Engineering

MS in Electrical/Materials Science

BS in related field

Tools

EBARA WS

Applied Materials CMP platforms

Job description

Micron is seeking a Principal Engineer for CMP process development to lead advanced 3D NAND technology programs and cross-functional initiatives. You will drive process characterization, optimization, and transfer to high-volume manufacturing, partnering with global teams and suppliers.

The role requires strong DOE, data analytics, and leadership skills to resolve complex yield and manufacturability challenges while advancing CMP capabilities for future nodes.