Principal CMP & 3D NAND Engineer — Next-Gen Memory

Micron Memory Malaysia Sdn Bhd; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. seeks a Staff/Principal Engineer to advance CMP processes for next-gen 3D NAND. You will develop and optimize CMP procedures, drive process margins, and collaborate with Wet, CVD, Diffusion, Metals, Lithography, and Dry Etch teams. Mentorship and patent-driven innovation are encouraged.

Required: Masters/PhD with 5–10 years in CMP, hands-on CMP equipment experience (AMAT/LKP, EBARA-300X), and strong communication skills. Singapore-based on-site role with global engagement.

Qualifications

• Masters/PhD with 5–10 years in semiconductor CMP (300mm wafers).
• Experience in CMP for memory tech (3D NAND).
• Strong collaboration and communication skills across global teams.

Responsibilities

• Develop and optimize CMP procedures for 3D NAND memory parts.
• Improve process margins to meet yield goals.
• Collaborate with multiple process areas and vendors to meet integration requirements.
• Mentor new hires on CMP fundamentals and Micron systems.
• Lead complex multi-functional improvement projects.

Skills

CMP Process Development

Dielectrics/Metals CMP

Equipment Operation (AMAT LKP)

Optical Metrology

Polishing Slurries & Pads

Strong Communication

Education

Masters/PhD in CMP or related field

Bachelor's in Engineering

Tools

AMAT LKP

EBARA-300X

Profilometry

Polishing Slurries

Polishing Pads

Job description

Micron Technology, Inc. seeks a Staff/Principal Engineer to advance CMP processes for next-gen 3D NAND. You will develop and optimize CMP procedures, drive process margins, and collaborate with Wet, CVD, Diffusion, Metals, Lithography, and Dry Etch teams. Mentorship and patent-driven innovation are encouraged.

Required: Masters/PhD with 5–10 years in CMP, hands-on CMP equipment experience (AMAT/LKP, EBARA-300X), and strong communication skills. Singapore-based on-site role with global engagement.