Staff/Principal Engineer - CMP Advanced NAND

Micron; Singapore; On-site; SGD 140,000 - 180,000; Full time

Job summary

Micron Singapore seeks a Staff/Principal Engineer to join the next generation NAND dry etch team, driving CMP process development and advanced 3D NAND integration.

You will develop CMP procedures, optimize margins, collaborate with vendors, mentor staff, and lead multi-functional projects, applying data science and AI to improve yields and manufacturability.

Qualifications

• PhD with 5+ years, or MSc with 7+ years, or BSc with 10+ years in Electrical/Materials/Chemical Engineering, Physics or related field, with CMP expertise in 300mm wafers.
• Experience in CMP process development for 3D NAND or memory tech.
• Strong interest in data science and AI to optimize workflows.

Responsibilities

• Develop and optimize CMP procedures for 3D NAND parts.
• Improve process margins to meet mature yield goals.
• Collaborate with vendors to meet integration requirements for next-gen NAND nodes.
• Lead multi-functional projects and provide strategic direction.
• Mentor new hires and push for breakthrough solutions.

Skills

CMP equipment

3D NAND CMP

Data science

AI in workflows

Communication

Education

PhD/MSc/BSc with CMP experience

Tools

AMAT LKP

EBARA-300X

Optical metrology

Job description

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Job Summary:

As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND .

Main Responsibilities:

• As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts.
• Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts
• Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications
• Initiate and manage experiments to widen process margins as well as to evaluate manufacturability of next node solutions
• Extensively collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3-D NAND nodes
• Incorporate best known manufacturing methods into early development phase of upcoming nodes
• Design and implement advanced process monitoring and control methodologies
• Provide strategic roadmap for N+, N++ and future NAND Nodes
• Serve as a technical expert within Micron contributing to technical projects for improvements to processes, procedures, and equipment
• Define and leads complex, multi-functional projects of critical importance to Micron, helps to define strategic direction
• Provide advice and counsel to management on significant technical issues. Leads and initiate innovation projects through patents/technical papers
• This position requires communication and collaboration with partners both locally and globally. Strict adherence to Micron Intellectual Property Protection policy is necessary

Other Responsibilities:

• Mentor new hires and less experienced team members on CMP fundamentals, process development, and Micron systems
• Engage with Procurement & Operations Central Teams and other partners both locally and globally pushing for breakthrough solutions
• As a technical expert, lead or drive team or sites on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost, and productivity improvement meetings

AI Responsibilities:

Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements

Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Minimum Required Qualifications/Experience

• PhD with ≥5 years, or Master's degree with ≥7 years, or Bachelor's degree with ≥10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field, with demonstrated expertise in semiconductor Experience in Chemical Mechanical Planarization (CMP) Process in 300mm wafer fabrication.

Must Have Technical Skills

• Hands-on experience CMP equipment operation such as AMAT (LKP), EBARA-300X and next generation CMP equipment, optical metrology, profilometry, polishing slurries, conditioners, and polishing pads
• Experience in dielectrics/metals CMP process development on 3D NAND or other memory technology
• Understanding of various integration and structural impacts and constraints related to film deposition and other upstream/downstream processes
• An understanding of the general process steps and process flow for memory processing planar and vertical NAND memory.
• Strong interest in Data science, modelling, and drive to use/adopt AI to optimize workflows.

Must Have Soft Skills

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.
• Strong collaboration and communication skills (verbal and written).
• Self-driven, adaptable, and able to manage multiple projects.
• Proven ability to