Principal CMOS Process Integration Engineer – 3D NAND Yield

Micron Technology, Inc.

Singapore

On-site

SGD 140,000 - 200,000

Full time

14 days+

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Job summary

Micron Technology, Inc. in Singapore seeks a Staff/Principal NAND CMOS Module Process Integration Engineer to design and implement advanced process solutions for next-generation 3D NAND yield and quality, balancing cost and performance.

You will lead cross-functional teams, refine CSPEC criteria, and drive technology transfer to manufacturing, with quarterly yield reviews and ongoing R&D collaboration. Willingness to travel to the US for extended periods is required.

Qualifications

  • BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field.
  • Minimum 3 years of experience in the semiconductor industry in Process Integration and Yield Enhancement.
  • Proficiency in scripting/programming/BI software such as Python, Tableau, Power BI; desirable.
  • Exposure to HKMG is desirable.

Responsibilities

  • Lead cross-functional teams to address module deficiencies and technology gaps.
  • Develop or redefine CSPEC criteria for optimal product performance and process capability.
  • Coordinate transfer of technology from R&D to manufacturing and support ramp-up.
  • Establish proof of concept for future tech nodes at the manufacturing facility.
  • Assist in quarterly yield summits and monthly program reviews.

Skills

data analysis
problem-solving
cross-functional teamwork
communication skills
AI literacy

Education

BS, MS/PhD in Electrical Engineering or Microelectronics

Tools

Python
Tableau
Power BI
SolidWorks

Job description

Micron Technology, Inc. in Singapore seeks a Staff/Principal NAND CMOS Module Process Integration Engineer to design and implement advanced process solutions for next-generation 3D NAND yield and quality, balancing cost and performance.

You will lead cross-functional teams, refine CSPEC criteria, and drive technology transfer to manufacturing, with quarterly yield reviews and ongoing R&D collaboration. Willingness to travel to the US for extended periods is required.

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