Lead 3D NAND Process Integration and Yield Innovator

Micron Technology; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Micron Technology Singapore is seeking a NAND Module Process Integration Engineer in our R&D department to design, develop, and implement innovative process solutions that improve next-generation 3D NAND yield and quality while balancing cost and performance.

You will lead cross-functional teams across Manufacturing, Engineering, and Supply Chain, translating product requirements into scalable manufacturing processes and driving qualification and ramp-up for new technologies.

Qualifications

• 2+ years in the semiconductor industry.
• Experience with data analysis, visualization or simulation tools is desirable.
• Knowledge of NAND process flow and failure mechanisms is desirable.

Responsibilities

• Design, develop, integrate and implement process solutions for next-generation 3D NAND.
• Lead cross-functional teams to address module deficiencies and drive manufacturability.
• Coordinate activities to secure funding for experiments and communicate decisions to R&D and Manufacturing.

Skills

Data analysis

Cross-functional teamwork

Communication skills

Semiconductor knowledge

Education

BS / MS in Materials Science or Electrical Engineering

Tools

JMP

Tableau

Job description

Micron Technology Singapore is seeking a NAND Module Process Integration Engineer in our R&D department to design, develop, and implement innovative process solutions that improve next-generation 3D NAND yield and quality while balancing cost and performance.

You will lead cross-functional teams across Manufacturing, Engineering, and Supply Chain, translating product requirements into scalable manufacturing processes and driving qualification and ramp-up for new technologies.