Senior NAND Process Integration Engineer | AI-Driven Yield

Micron Technology, Inc.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Senior/Principal NAND Module Process Integration Engineer to design, develop, integrate, and implement innovative process solutions for next-generation 3D NAND yield and quality with competitive cost and performance.

You will lead cross-functional teams, develop CSPEC criteria, coordinate site activities, and drive AI-enabled improvements across PI modules to support transfer to manufacturing.

Qualifications

• BS, MS or PhD in Electrical Engineering, Microelectronics, Chemical Engineering or related field.
• Minimum of 3 years of experience in semiconductor Process Integration and Yield Enhancement.
• Proficiency in scripting/programming/BI analytics software such as Python, SolidWorks, Tableau, Power BI, etc.

Responsibilities

• Identify and quantify module deficiencies and technology gaps; lead cross-functional teams to address issues and improve process flows.
• Develop or redefine CSPEC criteria for optimal product performance and drive capability.
• Coordinate activities to secure funding for experiments, conversions, and communicate decisions across R&D and Manufacturing partners.
• Lead development projects to evaluate new integration schemes and establish proofs of concept for future tech nodes.
• Participate in quarterly yield summits and monthly program reviews to summarize issues and actions to senior management.
• Assist in transfer of new technology from R&D to manufacturing; support ramp-up and qualification.

Skills

Data analysis

Cross-functional collaboration

Communication skills

Quality mindset

Self-motivation

Willingness to travel

Problem solving

Education

Electrical Engineering

Microelectronics

Chemical Engineering

Material Science

Tools

Python

SolidWorks

Tableau

Power BI

Job description

Micron Technology, Inc. in Singapore is seeking a Senior/Principal NAND Module Process Integration Engineer to design, develop, integrate, and implement innovative process solutions for next-generation 3D NAND yield and quality with competitive cost and performance.

You will lead cross-functional teams, develop CSPEC criteria, coordinate site activities, and drive AI-enabled improvements across PI modules to support transfer to manufacturing.