Staff/Principal NAND Process Integration Engineer Singapore

Micron Technology; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

Micron Technology is looking for a Staff/Principal NAND CMOS Module Process Integration Engineer for its Singapore R&D Department. The role involves designing innovative solutions to improve yield and quality for 3D NAND products. Candidates must possess at least a bachelor's degree in relevant fields and a passion for semiconductor technology.

The position requires excellent communication skills for teamwork and offers opportunities for travel to the U.S. for R&D collaboration.

Qualifications

• 3+ years of experience in the semiconductor industry in Process Integration and Yield Enhancement.
• Understanding of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge of NAND process flow and common yield & reliability issues.

Responsibilities

• Identify and quantify key module deficiencies and technology gaps.
• Develop or redefine CSPEC criteria for product performance.
• Coordinate activities to secure funding for experiments and communicate decisions.
• Evaluate and implement new integration schemes for alpha and derivative parts.
• Lead yield summits and summarize complex problems.

Skills

Data analysis

Problem-solving

Process integration optimization

Excellent communication

Team collaboration

Education

BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or related field

Tools

Python

SolidWorks

Tableau

Power BI

Job description

Micron Technology is looking for a Staff/Principal NAND CMOS Module Process Integration Engineer for its Singapore R&D Department. The role involves designing innovative solutions to improve yield and quality for 3D NAND products. Candidates must possess at least a bachelor's degree in relevant fields and a passion for semiconductor technology.

The position requires excellent communication skills for teamwork and offers opportunities for travel to the U.S. for R&D collaboration.