3D NAND Process Integration Engineer - Innovation Leader

Micron Technology, Inc.

Singapore

On-site

SGD 90,000 - 130,000

Full time

14 days+

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Job summary

Micron Technology, Inc. in Singapore is seeking a NAND Module Process Integration Engineer to design, develop, and implement advanced integration schemes for next-generation 3D NAND products.

You will focus on improving yield, quality, and cost efficiency while meeting tight timelines. You will lead cross-functional teams, refine CSPEC criteria, coordinate funding for experiments, and help transfer new technologies from R&D to manufacturing to ensure a successful ramp-up.

Qualifications

  • Minimum 2 years in the semiconductor industry.
  • Data analysis/visualization or simulation software experience (JMP, Tableau preferred).
  • Strong end-to-end understanding of PI modules for new NAND technologies.
  • Knowledge of NAND process flow and yield/reliability issues.
  • Experience in R&D product life cycle from design to manufacturing is desirable.

Responsibilities

  • Identify and quantify module deficiencies; lead cross-functional teams to address issues.
  • Develop or redefine CSPEC criteria for optimal product performance and drive process capability.
  • Coordinate funding for experiments and communicate decisions to R&D, Product Engineering, and Manufacturing partners.
  • Transfer new technology from R&D to manufacturing; support ramp-up and qualification.
  • Integrate AI-assisted tools to improve efficiency, quality, or effectiveness.

Skills

Semiconductor industry experience
Data analysis
NAND memory knowledge

Education

BS/MS/PhD in Material Science or Electrical Engineering or Microelectronics or Chemical or Physics Engineering

Tools

JMP
Tableau

Job description

Micron Technology, Inc. in Singapore is seeking a NAND Module Process Integration Engineer to design, develop, and implement advanced integration schemes for next-generation 3D NAND products.

You will focus on improving yield, quality, and cost efficiency while meeting tight timelines. You will lead cross-functional teams, refine CSPEC criteria, coordinate funding for experiments, and help transfer new technologies from R&D to manufacturing to ensure a successful ramp-up.

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