Packaging Engineer – Advanced Thermal & IVR Lab

Advanced Micro Devices (S) Pte Ltd; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Advanced Micro Devices (S) Pte Ltd in Singapore seeks a Packaging Engineer for the Singapore Advanced Packaging Lab to drive thermal and mechanical characterization of packaging materials and IVR test vehicles.

You will establish lab capabilities, run experiments, develop repeatable test methods and automation, analyze data, and translate results into actionable engineering insights for next-generation packaging programs.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, or related field.
• Hands-on experience in semiconductor packaging and materials characterization.
• Strong background in thermal engineering and mechanical testing with instrumentation.

Responsibilities

• Bring up, operate, maintain, and improve thermal and mechanical characterization workflows for packaging materials and assemblies.
• Perform thermo-mechanical measurements (TMA, DMA) and DSC to evaluate heat flow and material behavior under thermal load.
• Conduct mechanical tests (tensile, compression, bending) and analyze stress, modulus, and failure.
• Support TIM characterization and IVR test-vehicle work, including lab instrumentation setup.
• Develop Python-based automation for instrument control, data acquisition, processing, and reporting.
• Prepare test plans, calibration checks, and ensure safety and documentation in the lab.
• Collaborate with global AMD teams across design, modeling, reliability, and suppliers.

Skills

Thermal testing

Mechanical testing

Data analysis

Python

LabVIEW

MATLAB

Instrumentation

Collaboration

Troubleshooting

Education

Bachelor's degree in Mechanical Engineering

Master's degree preferred

Tools

TMA

DMA

DSC

Universal tester

Nanoindentation

Adhesion testing

Warpage metrology

TIM testing

Oscilloscopes

SMUs

DAQ

Job description

Advanced Micro Devices (S) Pte Ltd in Singapore seeks a Packaging Engineer for the Singapore Advanced Packaging Lab to drive thermal and mechanical characterization of packaging materials and IVR test vehicles.

You will establish lab capabilities, run experiments, develop repeatable test methods and automation, analyze data, and translate results into actionable engineering insights for next-generation packaging programs.