Packaging Engineer

Advanced Micro Devices (S) Pte Ltd; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Advanced Micro Devices (S) Pte Ltd in Singapore seeks a Packaging Engineer for the Singapore Advanced Packaging Lab to drive thermal and mechanical characterization of packaging materials and IVR test vehicles.

You will establish lab capabilities, run experiments, develop repeatable test methods and automation, analyze data, and translate results into actionable engineering insights for next-generation packaging programs.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, or related field.
• Hands-on experience in semiconductor packaging and materials characterization.
• Strong background in thermal engineering and mechanical testing with instrumentation.

Responsibilities

• Bring up, operate, maintain, and improve thermal and mechanical characterization workflows for packaging materials and assemblies.
• Perform thermo-mechanical measurements (TMA, DMA) and DSC to evaluate heat flow and material behavior under thermal load.
• Conduct mechanical tests (tensile, compression, bending) and analyze stress, modulus, and failure.
• Support TIM characterization and IVR test-vehicle work, including lab instrumentation setup.
• Develop Python-based automation for instrument control, data acquisition, processing, and reporting.
• Prepare test plans, calibration checks, and ensure safety and documentation in the lab.
• Collaborate with global AMD teams across design, modeling, reliability, and suppliers.

Skills

Thermal testing

Mechanical testing

Data analysis

Python

LabVIEW

MATLAB

Instrumentation

Collaboration

Troubleshooting

Education

Bachelor's degree in Mechanical Engineering

Master's degree preferred

Tools

TMA

DMA

DSC

Universal tester

Nanoindentation

Adhesion testing

Warpage metrology

TIM testing

Oscilloscopes

SMUs

DAQ

Job description

THE ROLE:

AMD's Heterogeneous Integration Technology team is seeking a Packaging Engineer to support the Singapore Advanced Packaging Lab. This role combines hands-on thermal and mechanical characterization of packaging materials and assemblies with Integrated Voltage Regulator (IVR) thermal and electrical test-vehicle characterization. The engineer will help establish laboratory capabilities, execute experiments, develop repeatable test methods and automation, analyze data, and translate results into actionable engineering insights for next-generation advanced packaging programs. The position offers broad exposure to materials, package mechanics, thermal behavior, instrumentation, test vehicles, and cross-functional collaboration with design, modeling, validation, reliability, facilities, suppliers, and global laboratory teams.

THE PERSON:

The successful candidate is a practical, curious, and detail-oriented engineer who enjoys working at the intersection of laboratory experimentation, instrumentation, data analysis, and advanced packaging technology. The candidate should be comfortable learning new equipment, troubleshooting complex setups, documenting methods, and working safely in a multidisciplinary laboratory. Strong collaboration, clear technical communication, disciplined execution, and a willingness to develop expertise across thermal, mechanical, and IVR characterization domains are important for success. The role involves close collaboration with global AMD engineering teams. The candidate should be comfortable participating occasionally in meetings and technical discussions outside standard local business hours, with reasonable notice where practicable, to support project execution, review results, and align across time zones.

KEY RESPONSIBILITIES:

• Bring up, operate, maintain, and improve thermal and mechanical characterization workflows for advanced packaging materials, components, substrates, and assembled packages.
• Perform thermo-mechanical measurements using a Thermomechanical Analyzer (TMA), characterize viscoelastic behavior using a Dynamic Mechanical Analyzer (DMA), conduct Differential Scanning Calorimetry (DSC) measurements to evaluate heat flow, and support package warpage and full-field deformation characterization under thermal loading using optical metrology.
• Execute tensile, compression, bending, and related mechanical tests using a universal testing system, including stress-strain analysis, modulus, strength, and failure characterization. Support nanoindentation and adhesion/bond testing to evaluate localized mechanical properties, hardness, stiffness, interfacial strength, and failure behavior.
• Perform thermal interface material (TIM) characterization using TIM test equipment, including thermal resistance, thermal impedance, thermal conductivity, bond-line thickness effects, pressure effects, and repeatability studies. Support Thermal Test Vehicle (TTV) characterization activities.
• Support the bring-up and characterization of Integrated Voltage Regulator (IVR) thermal test vehicles. Configure and operate laboratory instrumentation, including source-measure units (SMUs), multifunction DAQ/switch systems, multiplexers, digital I/O modules, oscilloscopes, power-rail probes, waveform generators, programmable DC power supplies, electronic loads, thermal heads, and temperature controllers.
• Develop and enhance Python-based automation for instrument control, data acquisition, data processing, visualization, and report generation. Collaborate with designers, silicon validation engineers, thermal engineers, and modeling teams to define measurement objectives, operating conditions, success criteria, and the data required for model calibration and design decisions.
• Prepare samples, fixtures, test plans, equipment configurations, calibration checks, and laboratory documentation while following applicable environmental, health, and safety requirements and laboratory procedures. Plan and execute designed experiments, and evaluate repeatability, measurement variation, uncertainty, and correlation across tools and laboratories.

PREFERRED EXPERIENCE:

• Hands-on laboratory or project experience in semiconductor packaging, materials characterization, thermal engineering, mechanical testing, electronics validation, or a related engineering environment.
• Exposure to characterization tools such as TMA, DMA, DSC, universal mechanical testing, warpage/deformation metrology, TIM testing, nanoindentation, and adhesion testing.
• Familiarity with electrical measurement and control equipment, including SMUs, DAQ/switch systems, multiplexers, oscilloscopes, probes, power supplies, electronic loads, thermal controllers, or chillers.
• Foundational understanding of heat transfer, thermal resistance, CTE mismatch, stress-strain behavior, viscoelasticity, materials transitions, uncertainty, and measurement repeatability.
• Ability to use Python, MATLAB, LabVIEW, or similar tools for automation and data analysis, and to interpret engineering drawings, schematics, instrument manuals, test specifications, and structured datasets.
• Experience organizing experiments, maintaining traceable data, performing basic statistical analysis, and communicating results through clear reports and presentations.
• Exposure in working with equipment suppliers, research partners, or cross-site engineering teams is desirable.

ACADEMIC CREDENTIALS:

• A Bachelor's or Master's degree in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, or a closely related technical discipline is preferred.