Innovative Package Designer — WLCSP & BGA Focus

SILICON BOX PTE. LTD.; Singapore; On-site; SGD 67,000 - 100,000; Full time

Job summary

SILICON BOX PTE. LTD. in Singapore seeks a Package Designer to contribute to product and tooling design, ensuring robust electrical routing and test vehicle concepts.

Candidates with wafer bumping, WLCSP, BGA or fan-out packaging experience are encouraged to apply. Fresh graduates are welcome to join a team that values design guidelines, risk assessment, and cross-functional collaboration in a dynamic manufacturing environment.

Qualifications

• Master's Degree in electrical/electronics engineering or similar.
• Good understanding of design guidelines and able to generate risk assessment reports for Fan-in/Fan-out processes.
• Experience using Cadence APD in RDL routing and mask design for wafer-level processes (Wafer bumping, WLCSP, BGA, eWLB, fan-out) is advantageous.
• Hands-on skills with LinkCAD, Cadence, CAM350, AutoCAD, GDS, and Gerber editors.
• Experience with PCB test board design.
• Fresh graduates are welcome to apply.

Responsibilities

• Generate, update, and revise electrical routing layouts based on netlists or customer designs.
• Generate test vehicle designs and related PCB designs.
• Prepare design risk assessment reports.
• Generate reticle and stencil designs.
• Prepare other schematics or drawings as requested.
• Review, maintain, and update design guidelines.
• Manage conversion of internal design to suppliers' final design.
• Document all drawing revisions and change records.
• Support audits.
• Any other ad-hoc duties as assigned.

Skills

RDL routing

Wafer bumping understanding

PCB test boards

Design guidelines

Risk assessment report

Education

Master's degree in electrical/electronics engineering

Tools

Cadence APD

LinkCAD

CAM350

AutoCAD

GDS

Gerber editors

Job description

SILICON BOX PTE. LTD. in Singapore seeks a Package Designer to contribute to product and tooling design, ensuring robust electrical routing and test vehicle concepts.

Candidates with wafer bumping, WLCSP, BGA or fan-out packaging experience are encouraged to apply. Fresh graduates are welcome to join a team that values design guidelines, risk assessment, and cross-functional collaboration in a dynamic manufacturing environment.