HBM Reliability Engineer: Yield & Qualification

Micron Technology, Inc.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an Engineer to join the HIG HBMSingapore team to define and develop reliability stress tests, qualification plans, and robust test flows for high-bandwidth memory products.

You will collaborate with Global Quality, Fab, HBM technology development, and design teams to reduce DPM, investigate failures with EFA/PFA, and drive process conversions that improve yield, quality, and performance.

Qualifications

• Experience with reliability testing and failure analysis methodologies.
• Strong understanding of CMOS technology, DRAM architecture, and device physics.
• Familiarity with data analysis, statistics, and scripting tools (Python/JMP).
• Clear written and spoken English communication, especially for technical concepts.

Responsibilities

• Define and develop reliability stress, test flows and test plans for Product Reliability.
• Define qualification plan, review progress, manage execution, and resolve gating issues.
• Drive down Extrinsic and Intrinsic Reliability through optimized test flows and strategy.
• Debug and identify root causes in reliability tests via EFA and PFA, drive improvements.
• Provide recommendations for new process conversions to reduce cost and improve yield.
• Collaborate with Fab, HBM Design/Development, System Development and Quality/Reliability teams.
• Support risk management with Product Managers/Leads and promote innovation.

Skills

Data analysis

Statistics

Python

JMP

Root cause analysis

Problem solving

Education

Bachelor’s or Master’s degree in Electrical and Electronics Engineering or related field

Tools

JMP

Python

Job description

Micron Technology, Inc. in Singapore is seeking an Engineer to join the HIG HBMSingapore team to define and develop reliability stress tests, qualification plans, and robust test flows for high-bandwidth memory products.

You will collaborate with Global Quality, Fab, HBM technology development, and design teams to reduce DPM, investigate failures with EFA/PFA, and drive process conversions that improve yield, quality, and performance.