Global Package Tech Director — Innovation & Strategy

Infineon Technologies AG; Singapore; On-site; SGD 340,000 - 560,000; Full time

Job summary

Infineon Technologies AG in Singapore is seeking a Director of Development to lead the Package Technology Development team. You will drive innovation from concept through production, shaping global packaging strategy and coordinating across Munich, Villach, Regensburg, and Kulim to balance cost, manufacturability, quality, and speed.

The role requires 10+ years in semiconductors, strong leadership of 20+ engineers, and a track record in developing and industrializing new packaging technologies

Qualifications

• Master’s or Bachelor’s Degree in Electrical, Electronics, Microelectronics, Mechanical, Materials Engineering.
• Minimum 10 years of experience in the semiconductor industry or a related field.
• Proven leadership experience managing a team of 20+ professionals.
• Proven experience developing and industrializing new package technologies from concept through production.
• Strong understanding of Design-for-Manufacturing, Design-for-Quality, and Design-to-Cost.
• Strong problem-solving and cross-functional collaboration across global development teams.

Responsibilities

• Lead the Package Technology Development team.
• Responsible for package development activities, including: package definition, concept engineering, reverse engineering, technology integration, and innovation.
• Build team capabilities to drive high performance from idea generation to production and realization.
• Support the Development Head in defining department strategy and package development roadmap.
• Represent Development with Business Divisions and global locations to align concepts and execution across locations.

Education

Master’s or Bachelor’s Degree in Electrical, Electronics, Microelectronics, Mechanical, Materials Engineering

Job description

Infineon Technologies AG in Singapore is seeking a Director of Development to lead the Package Technology Development team. You will drive innovation from concept through production, shaping global packaging strategy and coordinating across Munich, Villach, Regensburg, and Kulim to balance cost, manufacturability, quality, and speed.

The role requires 10+ years in semiconductors, strong leadership of 20+ engineers, and a track record in developing and industrializing new packaging technologies