Senior Staff Engineer, Automotive Package Innovation

Infineon Technologies AG; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Infineon Technologies AG in Singapore seeks an Automotive Package Concepts Engineer to translate automotive needs into package platform requirements and drive cross-functional development across global teams.

You will lead feasibility studies, coordinate with BU/QM/project teams, and identify opportunities with new packaging technologies while providing roadmap inputs to ATV. Fluency in English and strong collaboration are essential.

Qualifications

• Degree in electrical/electronics engineering, material science, or physics.
• 5+ years of experience in semiconductor or automotive industry.
• Experience with package concepts and BOM considerations (QFN/QFP/laminate).
• Proven leadership and cross-functional teamwork abilities.
• Strong communication and presentation skills in English.

Responsibilities

• Understand and translate automotive needs into package platform requirements.
• Align and harmonize requirements across stakeholders and teams.
• Lead feasibility studies and pre-development projects for package solutions.
• Provide roadmap inputs to ATV and act as primary contact for package topics.

Skills

Cross-functional collaboration

Technical leadership

Effective communication

Problem-solving

English proficiency

Education

Electrical engineering

Materials science

Physics

Job description

Infineon Technologies AG in Singapore seeks an Automotive Package Concepts Engineer to translate automotive needs into package platform requirements and drive cross-functional development across global teams.

You will lead feasibility studies, coordinate with BU/QM/project teams, and identify opportunities with new packaging technologies while providing roadmap inputs to ATV. Fluency in English and strong collaboration are essential.