Director Development

Infineon Technologies AG; Singapore; On-site; SGD 340,000 - 560,000; Full time

Job summary

Infineon Technologies AG in Singapore is seeking a Director of Development to lead the Package Technology Development team. You will drive innovation from concept through production, shaping global packaging strategy and coordinating across Munich, Villach, Regensburg, and Kulim to balance cost, manufacturability, quality, and speed.

The role requires 10+ years in semiconductors, strong leadership of 20+ engineers, and a track record in developing and industrializing new packaging technologies

Qualifications

• Master’s or Bachelor’s Degree in Electrical, Electronics, Microelectronics, Mechanical, Materials Engineering.
• Minimum 10 years of experience in the semiconductor industry or a related field.
• Proven leadership experience managing a team of 20+ professionals.
• Proven experience developing and industrializing new package technologies from concept through production.
• Strong understanding of Design-for-Manufacturing, Design-for-Quality, and Design-to-Cost.
• Strong problem-solving and cross-functional collaboration across global development teams.

Responsibilities

• Lead the Package Technology Development team.
• Responsible for package development activities, including: package definition, concept engineering, reverse engineering, technology integration, and innovation.
• Build team capabilities to drive high performance from idea generation to production and realization.
• Support the Development Head in defining department strategy and package development roadmap.
• Represent Development with Business Divisions and global locations to align concepts and execution across locations.

Education

Master’s or Bachelor’s Degree in Electrical, Electronics, Microelectronics, Mechanical, Materials Engineering

Job description

Shape the future of package technology. As Director Development, you will lead a high-performing Package Technology Development team, driving innovation from early concepts through industrialization and production. You will influence global package strategy, strengthen technical capabilities, and collaborate across international development locations to deliver cutting-edge solutions with the right balance of cost, manufacturability, quality, and speed.

Your role

Key responsibilities in your new role

• Lead the Package Technology Development team
• Responsiblefor package development activities, including:
  • Package definition
  • Concept engineering
  • Reverse engineering
  • Technology Integration
  • Innovation and technology development
• Build team capabilities and competencies to drive high performance in new packageand technology concepts, from idea generation through projectrealization and productio
• Asp art of the management team, drive key development targets,including Design-to-Cost, Design-for-Manufacturing, Design-for-Quality,and Time-to-Market
• Leadproblem-solving activities, focus teams, and task forces across development projects to ensuresuccessful delivery of agreed target
• Support the Development Head in defining thedepartment strategy and package development roadmap to enablebusiness success and maintain technology leadership
• Represent the Development function and collaboratewith Business Divisions and global development locations, includingMunich, Villach, Regensburg, and Kulim, on package concepts, strategy,and execution.
• Drive technical leadership and capability development across key package developmentdisciplines, including concept engineering, material engineering, andunit process engineering.

Your profile

Qualifications and skills to help you succeed

• Master’s or Bachelor’s Degree in Electrical, Electronics, Microelectronics, Mechanical, MaterialsEngineering, or a related engineering discipline.
• Minimum 10 years of experience in the semiconductor industry or a related field.
• Proven leadership experience managing a team of 20+professionals, including engineers, staff engineers, and team managers.
• Proven experience in developing and industrializing new packagetechnologies, from concept through production.
• Strong understanding of Design-for-Manufacturing, Design-for-Quality,and Design-to-Cost principles.
• Strong problem-solving, stakeholder management, and cross-functionalcollaboration skills, with the ability to work effectively across globaldevelopment teams.

#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

Mandy Neoh