Lead Automotive Package Concepts Engineer

Infineon Technologies

Singapore

On-site

SGD 90,000 - 150,000

Full time

14 days+

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Job summary

Infineon Technologies in Singapore is seeking an Automotive Package Concepts Engineer to shape the future of power electronics packaging. You will translate automotive needs into platform requirements and lead cross-functional teamwork across BU, QM, and project teams.

You bring a degree in electrical engineering or related field, 5+ years in semiconductor or automotive packaging, and fluent English. The role involves market screening, feasibility studies, and providing roadmaps to OSAT and BE

Qualifications

Degree in electrical/electronics engineering, materials science, or physics.
5+ years of experience in the semiconductor or automotive industry.
Fluent in English.

Responsibilities

Translate automotive application and product needs into package platform requirements.
Align, harmonize requirements across stakeholders.
Lead feasibility studies, innovation, and pre-development projects for package solutions.
Assess project complexity with package development teams, balancing technical, cost, and quality aspects.