Packaging Design Intern — Global Data Analytics & App Dev

Infineon Technologies AG; Singapore; On-site; SGD 16,740 - 23,436; Part time

Job summary

Infineon Technologies AG in Singapore offers a packaging design internship. You will analyze datasets, understand electrical/structural packaging criteria, and develop a dashboard for package selection while building an app for package information retrieval.

You will collaborate with a global team, gain exposure to advanced packaging concepts, and prepare for a fast-paced product launch environment in automotive and IoT contexts.

Qualifications

• Education in engineering with interest in packaging or semiconductor tech.
• Analytical mindset with ability to handle complex datasets.
• Exposure to AI, digitalisation or programming is a plus.
• Proactive, adaptable and self-motivated with good organization.

Responsibilities

• Understand package criteria electrically, structurally and quality standards.
• Analyze large datasets to inform package concepts for decision-making.
• Collect, clean and organize data from multiple sources for analysis.
• Develop a dashboard for package selection and build a package information app.

Skills

Analytical capability

Digital programming exposure

Initiative & adaptability

Self-management

Semiconductor fundamentals

Education

Bachelor's/Master's pursuing engineering studies

Tools

Dashboard development

Mobile app development

Job description

Infineon Technologies AG in Singapore offers a packaging design internship. You will analyze datasets, understand electrical/structural packaging criteria, and develop a dashboard for package selection while building an app for package information retrieval.

You will collaborate with a global team, gain exposure to advanced packaging concepts, and prepare for a fast-paced product launch environment in automotive and IoT contexts.