Electroplating Process Engineering Lead

WhiteCrow Research Pvt. Ltd.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

WhiteCrow Research Pvt. Ltd. is seeking a Process Engineering Manager (Electroplating) for its client in Singapore. You will lead engineers, drive copper plating and wafer-level packaging projects, and deliver advanced process solutions to a broad product family.

You will guide technology development, DOE-driven characterization, and root cause analysis, while mentoring teams and delivering expert technical reports and executive presentations.

Qualifications

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
• 8+ years of semiconductor process engineering experience, including hands-on electroplating experience.
• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs and advanced packaging.
• Proven experience leading process development, technology innovation and product qualification in an R&D environment.
• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.
• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
• Strong communication skills with ability to prepare technical reports, specifications, and executive presentations.

Responsibilities

• Managing engineers in utilizing techniques to characterize hardware and apply new technologies.
• Managing, developing, planning and executing process engineering projects for the full product range.
• Interacting with key customers to resolve complex process engineering issues.
• Developing and implementing new technology, products and analytical instrumentation.
• Training and implementing new methodologies and technologies; perform root cause analysis.
• Generating internal and external documentation for products and specifications.
• Contributing to market share gains through technology improvements.

Skills

Leadership

Process engineering

DOE

Statistical analysis

Root cause analysis

Communication

Project management

Electroplating

Copper plating

Wafer-level packaging

RDL

TSVs

Education

Bachelor’s/Master’s/PhD in Chemical Eng., Materials Science, Chemistry, Electrical Engineering or related field

Job description

WhiteCrow Research Pvt. Ltd. is seeking a Process Engineering Manager (Electroplating) for its client in Singapore. You will lead engineers, drive copper plating and wafer-level packaging projects, and deliver advanced process solutions to a broad product family.

You will guide technology development, DOE-driven characterization, and root cause analysis, while mentoring teams and delivering expert technical reports and executive presentations.