Lead Electroplating Process Engineer – Advanced Packaging

APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.; Singapore; On-site; SGD 150,000 - 210,000; Full time

Job summary

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to lead development and optimization of next-generation electroplating processes at our Singapore APDC.

You will manage a team of engineers, drive technology innovation, and collaborate with global cross-functional groups to deliver advanced packaging solutions; located at Science Park II, moving to Tampines in 2027.

Qualifications

• 8+ years of semiconductor process engineering experience in electroplating.
• Experience leading process development and product qualification in R&D.
• Proven leadership of engineering teams and mentoring capability.
• Strong communication and technical reporting skills.
• Experience collaborating with customers and cross-functional teams on complex technical challenges.

Responsibilities

• Lead development and optimization of electroplating processes for advanced packaging applications.
• Manage engineers, plan and execute process engineering projects.
• Interact with customers to resolve complex process engineering issues.
• Develop and implement new technology and instrumentation.
• Train and mentor engineering staff and define new methodologies.

Skills

Electroplating

Copper plating

Wafer-level packaging

RDL

Copper pillars

TSVs

Advanced packaging

DOE

Statistical analysis

Root cause analysis

Education

Bachelors/Masters/PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering

Job description

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to lead development and optimization of next-generation electroplating processes at our Singapore APDC.

You will manage a team of engineers, drive technology innovation, and collaborate with global cross-functional groups to deliver advanced packaging solutions; located at Science Park II, moving to Tampines in 2027.