Process Engineering Manager (Electroplating)

WhiteCrow Research Pvt. Ltd.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

WhiteCrow Research Pvt. Ltd. is seeking a Process Engineering Manager (Electroplating) for its client in Singapore. You will lead engineers, drive copper plating and wafer-level packaging projects, and deliver advanced process solutions to a broad product family.

You will guide technology development, DOE-driven characterization, and root cause analysis, while mentoring teams and delivering expert technical reports and executive presentations.

Qualifications

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
• 8+ years of semiconductor process engineering experience, including hands-on electroplating experience.
• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs and advanced packaging.
• Proven experience leading process development, technology innovation and product qualification in an R&D environment.
• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.
• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
• Strong communication skills with ability to prepare technical reports, specifications, and executive presentations.

Responsibilities

• Managing engineers in utilizing techniques to characterize hardware and apply new technologies.
• Managing, developing, planning and executing process engineering projects for the full product range.
• Interacting with key customers to resolve complex process engineering issues.
• Developing and implementing new technology, products and analytical instrumentation.
• Training and implementing new methodologies and technologies; perform root cause analysis.
• Generating internal and external documentation for products and specifications.
• Contributing to market share gains through technology improvements.

Skills

Leadership

Process engineering

DOE

Statistical analysis

Root cause analysis

Communication

Project management

Electroplating

Copper plating

Wafer-level packaging

RDL

TSVs

Education

Bachelor’s/Master’s/PhD in Chemical Eng., Materials Science, Chemistry, Electrical Engineering or related field

Job description

We are global talent research, insight and pipelining specialists with offices in the UK, USA, Singapore, Malaysia, Hong Kong, Dubai, and India. Our international reach has helped us to understand and penetrate specialist markets at a global level. In addition to this, our service is also extended to complement our client’s in-house research.

About our client

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next-generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world’s brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

As a Process Engineering Manager (Electroplating), you will be responsible for...

• Managing engineers in utilizing techniques to characterize hardware, defining methods and new technologies and applying them to characterize hardware, and/or performing hardware characterization on significantly complex systems for entire range of products
• Managing, developing, planning and executing process engineering projects for entire range of products
• Interacting with key customers to resolve significantly complex process engineering issues for entire range of products
• Developing and implementing new technology, products and analytical instrumentation
• Training, defining and implementing new methodologies, defining and applying new technologies, and/or troubleshoot, performing Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products
• Generating internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validating process engineering specifications for integrated products
• Contributing to market share gains through technology improvement.

What you already have...

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
• 8+ years of semiconductor process engineering experience, including hands‑on expertise in electroplating/electrochemical deposition technologies.
• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.
• Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.
• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
• Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.
• Experience collaborating with customers and cross-functional teams to resolve complex technical challenges.
• Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.