Senior Process Engineering Lead - Electroplating & Packaging

Applied Materials South East Asia; Singapore; On-site; SGD 150,000 - 190,000; Full time

Benefits offered by this job

Relocation assistance

Travel opportunities (10% of time)

Job summary

Applied Materials in Singapore is seeking a Manager, Process Engineering (Electroplating) to lead the development and optimization of electroplating processes for advanced semiconductor packaging. You will manage engineers and collaborate across global teams to deliver differentiated technology solutions.

The ideal candidate has 8+ years in semiconductor process engineering, strong copper plating expertise (wafer‑level packaging, RDL, TSVs), and proven leadership in R&D.

Qualifications

• 8+ years of semiconductor process engineering experience, including hands-on electroplating/electrochemical deposition technologies.
• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.
• Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.

Responsibilities

• Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products
• Manage, develop, plan and execute process engineering projects for entire range of products
• Interact with key customers to resolve significantly complex process engineering issues for entire range of products
• Develop and implement new technology, products and analytical instrumentation
• Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products
• Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products
• Contributes to market share gains through technology improvement

Skills

Electroplating

Copper plating

DOE

Leadership

Process characterization

Education

Bachelor’s/Master’s/PhD in Chemical Engineering or related

Tools

Analytical instrumentation

Statistical software

Job description

Applied Materials in Singapore is seeking a Manager, Process Engineering (Electroplating) to lead the development and optimization of electroplating processes for advanced semiconductor packaging. You will manage engineers and collaborate across global teams to deliver differentiated technology solutions.

The ideal candidate has 8+ years in semiconductor process engineering, strong copper plating expertise (wafer‑level packaging, RDL, TSVs), and proven leadership in R&D.