Manager, Process Engineering (Electroplating)

Applied Materials South East Asia Pte Ltd; Singapore; On-site; SGD 150,000 - 210,000; Full time

Job summary

Applied Materials Singapore seeks a Manager, Process Engineering (Electroplating) to lead development and optimization of electroplating processes for advanced semiconductor packaging. You will manage a team of engineers, drive process innovation, and collaborate with global cross-functional teams to deliver differentiated products and technology solutions.

The role requires strong leadership, extensive electroplating expertise, and a track record in DOE, statistical analysis, and problem

Qualifications

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
• 8+ years of semiconductor process engineering experience with hands-on electroplating/electrochemical deposition.
• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging.
• Proven experience leading process development, technology innovation, and product qualification in R&D.
• Demonstrated people leadership to mentor engineering teams.
• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
• Excellent communication for technical reports, specs, and executive presentations.

Responsibilities

• Lead the development and optimization of electroplating processes for advanced packaging.
• Manage a team of engineers and oversee process engineering projects.
• Collaborate with customers and cross-functional teams to resolve complex issues.
• Develop new technologies, products, and analytical instrumentation.
• Document specifications, reports, and presentations for products.
• Drive technology improvements to increase market share.

Skills

Electroplating expertise

Process engineering leadership

DOE & Statistical analysis

Cross-functional collaboration

Troubleshooting complex processes

Education

Bachelors/Masters/PhD in related field

Job description

Applied Materials is seeking a Manager, Process Engineering (Electroplating) to join our Singapore's Advanced Packaging Development Center (APDC) team. This role will lead the development and optimization of next-generation electroplating processes and technologies for advanced semiconductor packaging applications. The successful candidate will manage a team of engineers, drive process innovation, support customer engagements, and collaborate across global cross-functional teams to deliver differentiated products and technology solutions.

Key Responsibilities

• Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products

• Manage, develop, plan and execute process engineering projects for entire range of products

• Interact with key customers to resolve significantly complex process engineering issues for entire range of products

• Develop and implement new technology, products and analytical instrumentation

• Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products

• Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products

• Contributes to market share gains through technology improvement

Requirements

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.

• 8+ years of semiconductor process engineering experience, including hands‑on expertise in electroplating/electrochemical deposition technologies.

• Strong knowledge of copper plating, wafer‑level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.

• Proven experience leading process development, technology innovation, and product qualification in an R&D environment.

• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.

• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.

• Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.

• Experience collaborating with customers and cross‑functional teams to resolve complex technical challenges.

• Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.

Work Location

• Science Park II (Moving to Tampines office starting Apr 2027)