Electroplating Process Engineering Manager - Semiconductors

Applied Materials, Inc.; Singapore; On-site; SGD 180,000 - 260,000; Full time

Benefits offered by this job

Relocation assistance

Travel 10%

Job summary

Applied Materials, Inc. in Singapore seeks a Manager, Process Engineering (Electroplating) to lead the development and optimization of electroplating processes for advanced semiconductor packaging.

You will manage a team of engineers, drive process innovation, support customer engagements, and collaborate across global cross-functional teams to deliver differentiated products. The role requires 8+ years in semiconductor process engineering, strong copper plating knowledge, leadership experience,

Qualifications

• 8+ years of semiconductor process engineering experience, including electroplating/electrochemical deposition.
• Experience leading process development, technology innovation, and product qualification in R&D.
• Strong ability to mentor engineering teams and collaborate with cross-functional groups.

Responsibilities

• Lead development and optimization of electroplating processes for advanced packaging.
• Manage engineers, plan projects, and drive technology improvements.
• Interact with customers to resolve complex process engineering issues.
• Develop and implement new technology, products and analytical instrumentation.
• Train teams and apply new methodologies; perform root-cause analysis.
• Prepare technical reports, specifications, and executive presentations.
• Contribute to market share gains through technology improvements.

Skills

Copper plating expertise

Wafer-level packaging

RDL, copper pillars, TSVs

Process development leadership

DOE & statistical analysis

Technical reporting & presentations

Education

Bachelor's, Master's or PhD in Chemical Engineering / Materials Science / Chemistry / Electrical Engineering or related field

Job description

Applied Materials, Inc. in Singapore seeks a Manager, Process Engineering (Electroplating) to lead the development and optimization of electroplating processes for advanced semiconductor packaging.

You will manage a team of engineers, drive process innovation, support customer engagements, and collaborate across global cross-functional teams to deliver differentiated products. The role requires 8+ years in semiconductor process engineering, strong copper plating knowledge, leadership experience,