Associate Engineer - Wafer Bumping Process Engineering

UTAC; Singapore; On-site; SGD 36,000 - 54,000; Full time

Job summary

UTAC in Singapore invites applications for an Associate Engineer - Wafer Bumping Process Engineering. This entry-level role supports wet-process line activities including metal etch, plating and strip, with a focus on yield and cost efficiency.

You will work with QM for customer inquiries, assist CIP projects, maintain SPC, evaluate new materials, and set up new tools. Join a hands-on manufacturing team and grow in semiconductor packaging.

Responsibilities

• Line sustaining for wet processes (i.e. Metal Etch, Plating and PR Strip)
• Support lot dispositions and OCAP executions
• Working with QM Dept. to response customer inquires and issues
• Execute CIP or project handling that contributes yield & cost efficiency improvement
• Ensure SPC is maintain and in control
• Support new material evaluation and new tool set up

Job description

Join to save Associate Engineer - Wafer Bumping Process Engineering at UTAC

• Line sustaining for wet processes (i.e. Metal Etch, Plating and PR Strip)
• Support lot dispositions and OCAP executions
• Working with QM Dept. to response customer inquires and issues
• Execute CIP or project handling that contributes yield & cost efficiency improvement
• Ensure SPC is maintain and in control
• Support new material evaluation and new tool set up

Seniority level

• Entry level

Employment type

• Full-time

Job function

• Manufacturing
• Manufacturing

Referrals increase your chances of interviewing at UTAC by 2x

Find curated posts and insights for relevant topics all in one place.