Semicon Wafer Bumping Equipment Senior/ Engineer

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

PEOPLE PROFILERS PTE. LTD. in Singapore invites an equipment engineer to maintain, troubleshoot, and optimize wafer bumping tools to maximize uptime, stable production, and yield.

You will work with process engineers and vendors to install, qualify, and support equipment such as plating, PVD, lithography, cleaning, stripping, and reflow systems; perform preventive and corrective maintenance and document safety standards.

Qualifications

• Degree in Engineering or related field.
• 2–5 years of equipment engineering experience with plating, PVD/sputtering, lithography, cleaning, stripping, and reflow systems.
• Experience in wafer bumping or semiconductor backend/advanced packaging is an advantage.
• Strong mechanical/electrical troubleshooting and problem-solving skills.
• Good communication and teamwork skills.

Responsibilities

• Install, qualify, maintain, and troubleshoot wafer bumping equipment.
• Support equipment such as plating, PVD/sputtering, lithography, cleaning, stripping, and reflow systems.
• Perform preventive/corrective maintenance and root-cause analysis.
• Improve equipment uptime, OEE, MTBF, and MTTR.
• Support new equipment installation, upgrades, and production ramp-up.
• Work with process engineers and vendors to resolve equipment/process issues.
• Maintain equipment documentation and safety standards.

Skills

Equipment maintenance

Troubleshooting

Root-cause analysis

Teamwork

Education

Engineering degree

Tools

Plating equipment

PVD/Sputtering

Lithography equipment

Cleaning systems

Reflow systems

Job description

Job Summary

Responsible for maintaining, troubleshooting, and optimizing wafer bumping equipment toensure high equipment uptime, stable production, and good yield.

Key Responsibilities

• Install,qualify, maintain, and troubleshoot wafer bumping equipment.
• Support equipment such as plating, PVD/sputtering, lithography, cleaning, stripping,and reflow systems.
• Perform preventive/corrective maintenance and root-cause analysis.
• Improveequipment uptime, OEE, MTBF, and MTTR.
• Supportnew equipment installation, upgrades, and production ramp-up.
• Work with process engineers and vendors to resolve equipment/process issues.
• Maintain equipment documentation and safety standards.

Requirements

• Degree in Engineering or related field.
• 2–5years of equipment such as plating, PVD/sputtering, lithography, cleaning,stripping, and reflow systems equipmentengineering experience preferred.
• Experience in wafer bumping or semiconductor backend/advanced packaging is an advantage.
• Strong mechanical/electrical troubleshooting and problem-solving skills.
• Good communication and teamwork skills.

All Successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.