Process Engineer - Lithography & PVD Process Optimization

United Test And Assembly Center Limited (UTAC)

Singapore

On-site

SGD 70,000 - 110,000

Full time

14 days+
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Job summary

United Test And Assembly Center Limited (UTAC) is seeking a process engineer to troubleshoot process and quality issues and own documentation for PMFEA, OCAP, and WI/SOP. The role includes leading CIPs, planning new process development, and collaborating with cross-functional teams to implement new processes and packages.

Ideal candidates have 3+ years in semiconductor manufacturing with dry or wet process exposure, strong SPC and analytical skills, and proficiency with Excel and power tools for

Qualifications

  • Degree in Engineering or Science or related field.
  • 3+ years in semiconductor manufacturing with exposure to dry or wet processes.
  • Strong SPC and problem-solving skills.

Responsibilities

  • Respond quickly to process or quality issues in assigned module and troubleshoot effectively.
  • Owner of PMFEA, OCAP and WI/SOP for documentation and update.
  • Propose and lead process CIPs for chronic issue resolving.
  • Plan and execute new process/package development and evaluations.
  • Perform process margin study to determine process capability of new process/package.
  • Lead evaluation lots and report results in a timely manner.
  • Provide technical training and support for troubleshooting process issues.
  • Collaborate with cross-functional teams to ensure smooth implementation of new processes/packages.

Skills

SPC proficiency
Problem solving
Excel & PowerPoint
CAD / JMP / Minitab
Documentation & communication

Education

Engineering or Science degree

Tools

CAD
JMP
Minitab
MS Excel
PowerPoint

Job description

United Test And Assembly Center Limited (UTAC) is seeking a process engineer to troubleshoot process and quality issues and own documentation for PMFEA, OCAP, and WI/SOP. The role includes leading CIPs, planning new process development, and collaborating with cross-functional teams to implement new processes and packages.

Ideal candidates have 3+ years in semiconductor manufacturing with dry or wet process exposure, strong SPC and analytical skills, and proficiency with Excel and power tools for

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