Senior / Engineer – Yield & Process Integration

UNITED TEST AND ASSEMBLY CENTER LTD; Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

UNITED TEST AND ASSEMBLY CENTER LTD in Singapore is seeking an experienced Yield Engineer focused on process yield engineering and bump process integration. You will collaborate with cross-functional teams to troubleshoot issues in Dry and Wet wafer bumping and lead DOE initiatives.

The role requires a degree in engineering and at least 3 years in semiconductors, with strong skills in SPC, APQP and data analysis, plus problem-solving and analytical abilities to drive improvements and support

Qualifications

• Degree in engineering is required.
• Minimum 3 years of relevant semiconductor experience.
• Familiar with SPC, APQP, and data analysis tools.
• Strong problem-solving and analytical skills.

Responsibilities

• Focus on process yield engineering and bump process integration; collaborate with cross-functional teams to troubleshoot and resolve issues in Dry and Wet wafer bumping, including DOEs.
• Responsible for data analysis for yield and trend detection.
• Lead continuous improvement projects and device qualifications using APQP approach.
• Execute CIP or projects that improve yield and cost efficiency.
• Review and propose updates to SPC limits to improve product quality and stability.
• Take ownership of customer technical inquiries and lead NPI-to-mass production transitions.
• Coordinate customer-initiated BKM exercises.

Skills

SPC

APQP

Data analysis

Problem-solving

Education

Engineering degree

Job description

Responsibilities:

• Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs)
• Responsible to look into data analysis for yield and detect trend
• Lead continuous improvement projects & device qualifications using APQP approach
• Execute CIP (Continuous Improvement Program) or project handling that contributes yield & cost efficiency improvement
• Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability
• Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production.
• Overall coordinator of customer's initiated BKM exercise

Requirements:

• Degree in Engineering
• Minimum 3 years of relevant experience preferably in the semiconductor industry
• Familiar with SPC, APQP, and data analysis tools
• Strong problem-solving and analytical skills