Process Engineer – Sputter, Lithography & Yield Improvement

United Test And Assembly Center Limited (UTAC); Singapore; On-site; SGD 42,000 - 64,000; Full time

Job summary

UTAC, located in Singapore, is seeking a Diploma-qualified technician to support wafer bumping processes and continuous improvement initiatives. The role focuses on line sustaining for dry processes, SPC control, and collaboration with QM to address customer inquiries.

Experience in high-volume wafer bumping and OCAP procedures is preferred. The candidate will assist with material evaluation, tool setup, and CIP projects to enhance yield and cost efficiency in a dynamic wafer fabrication

Qualifications

• Diploma required in electronics or related disciplines.
• Preferably with minimum 2 years' experience in Wafer bumping process running high volume.
• Knowledge of SPC and OCAP is required.

Responsibilities

• Line sustaining for dry process (Sputter, Photolithography, Descum).
• Support lot dispositions and OCAP executions.
• Involve in Continuous Improvement Projects.
• Collaborate with QM to respond to customer inquiries and issues.
• Execute CIP or project handling that improves yield and cost efficiency.
• Ensure SPC is maintained and in control.
• Support new material evaluation and new tool setup.

Education

Diploma in electronics or related disciplines

Job description

UTAC, located in Singapore, is seeking a Diploma-qualified technician to support wafer bumping processes and continuous improvement initiatives. The role focuses on line sustaining for dry processes, SPC control, and collaboration with QM to address customer inquiries.

Experience in high-volume wafer bumping and OCAP procedures is preferred. The candidate will assist with material evaluation, tool setup, and CIP projects to enhance yield and cost efficiency in a dynamic wafer fabrication