Engineering Director (Advanced Semiconductor Packaging)

Achieve Group; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Achieve Group in Singapore is seeking a senior engineering leader to direct multi-discipline teams across process, mechanical, electrical, software, optics and metrology to deliver complex semiconductor capital equipment from concept to customer acceptance.

You will own architecture and overlay error budgets, define alignment strategies, manage budgets and schedules, ensure qualification, and guide transfer to manufacturing while building a strong IP portfolio and mentoring senior specialists.

Qualifications

• MS or PhD in mechanical, electrical, mechatronics or optical engineering, or physics.
• 15+ years in semiconductor capital equipment.
• 7+ years leading multi-discipline engineering teams.
• Delivered at least one precision tool from concept to customer acceptance.
• Deep expertise in sub-micron optical alignment and error budgeting.

Responsibilities

• Lead multi-discipline teams: process, mechanical, electrical and controls, software, optics and metrology, systems and lab
• Own system architecture and the placement and overlay error budget, from concept through to a qualified tool at customer sites
• Set the alignment strategy, including camera architecture, mark design rules, calibration and closed-loop overlay correction
• Manage engineering budget, schedule, technical risk and make-vs-buy decisions
• Work with Applications, Quality and Operations on tool qualification, SEMI S2/S8 compliance and transfer to manufacturing
• Set the roadmap toward finer pitch and tighter overlay, and build the BU’s IP portfolio
• Hire and develop senior specialists in bond head, motion, optics, vision and equipment software

Skills

Lead multi-discipline teams

Optical alignment

Precision motion control

Thermal management

Machine vision

Talent development

Education

MS/PhD in Mechanical or Electrical or Mechatronics or Optical Eng or Physics

Job description

• Lead multi-discipline teams: process, mechanical, electrical and controls, software, optics and metrology, systems and lab
• Own system architecture and the placement and overlay error budget, from concept through to a qualified tool at customer sites
• Set the alignment strategy, including camera architecture, mark design rules, calibration and closed-loop overlay correction
• Manage engineering budget, schedule, technical risk and make-vs-buy decisions
• Work with Applications, Quality and Operations on tool qualification, SEMI S2/S8 compliance and transfer to manufacturing
• Set the roadmap toward finer pitch and tighter overlay, and build the BU’s IP portfolio
• Hire and develop senior specialists in bond head, motion, optics, vision and equipment software

What you bring

• MS or PhD in mechanical, electrical, mechatronics or optical engineering, or physics
• 15+ years in semiconductor capital equipment, including 7+ years leading multi-discipline engineering teams
• Delivered at least one precision placement, bonding, lithography or metrology tool from concept to customer acceptance
• Deep expertise in sub-micron optical alignment and error budgeting
• Strong grounding in precision motion control, thermal and vibration management, and machine vision
• Track record of hiring, developing and retaining senior technical talent

Good to have

• Direct experience with hybrid bonding, TCB or flip-chip bonders, or wafer-to-wafer aligners
• Patents or publications in alignment optics, precision motion or bonding
• Experience qualifying tools with foundries, IDMs or OSATs

We regret that only shortlisted candidates will be notified. Thank you for your interest in this opportunity.