Advanced Packaging & Thermal Characterization Engineer

ADVANCED MICRO DEVICES (SINGAPORE) PTE LTD; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

ADVANCED MICRO DEVICES (SINGAPORE) PTE LTD is seeking a Packaging Engineer to support the Singapore Advanced Packaging Lab. This role combines hands‑on thermal and mechanical characterization of packaging materials and assemblies with IVR test‑vehicle work.

You will establish lab capabilities, run experiments, and translate results into actionable insights for next‑gen packaging programs. The successful candidate works with cross‑functional teams across design, modeling, reliability, facilities,

Qualifications

• Experience in semiconductor packaging or materials characterization is preferred.
• Proficiency with thermal and mechanical testing equipment.
• Ability to automate data acquisition, processing, and visualization using Python or MATLAB.
• Strong written and verbal communication for cross‑functional teams.

Responsibilities

• Bring up and maintain thermal/mechanical characterization workflows.
• Perform thermo‑mechanical measurements and DSC to evaluate heat flow.
• Conduct mechanical tests (tension, compression, bending) and analyze stress‑strain behavior.
• Characterize TIMs and support TTV/IVR thermal test vehicles.
• Develop Python‑based automation for instrument control and data handling.
• Prepare experiments, ensure data traceability, and document results.

Skills

Thermal characterization

Mechanical testing

Data analysis

Python

MATLAB

LabVIEW

Automation

Instrumentation

Cross-functional collaboration

Statistical analysis

Education

Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science & Engineering, Electrical Engineering

Tools

TMA

DMA

DSC

Universal mechanical testing

Warpage/metrology

TIM testing

Nanoindentation

Adhesion testing

SMUs

DAQ/switch systems

Oscilloscopes

Job description

ADVANCED MICRO DEVICES (SINGAPORE) PTE LTD is seeking a Packaging Engineer to support the Singapore Advanced Packaging Lab. This role combines hands‑on thermal and mechanical characterization of packaging materials and assemblies with IVR test‑vehicle work.

You will establish lab capabilities, run experiments, and translate results into actionable insights for next‑gen packaging programs. The successful candidate works with cross‑functional teams across design, modeling, reliability, facilities,