3D NAND Process Integration Engineer: Drive Next-Gen Memory

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD in Singapore seeks a NAND Module Process Integration Engineer in the R&D group. This role designs, develops, and implements innovative process solutions to improve next‑generation 3D NAND yield and quality while balancing cost and performance.

You will lead cross‑functional teams, define CSPEC criteria, and coordinate site activities to secure funding for experiments and communications with R&D, Product Engineering, and Manufacturing partners.

Qualifications

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and ability to work in cross-functional teams.

Responsibilities

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and optimally communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing
• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements
• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Skills

Data analysis

Problem solving

Cross-functional teamwork

Communication skills

NAND/3D NAND knowledge

Process integration optimization

Education

BS, MS/PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering

Tools

JMP

Tableau

Job description

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD in Singapore seeks a NAND Module Process Integration Engineer in the R&D group. This role designs, develops, and implements innovative process solutions to improve next‑generation 3D NAND yield and quality while balancing cost and performance.

You will lead cross‑functional teams, define CSPEC criteria, and coordinate site activities to secure funding for experiments and communications with R&D, Product Engineering, and Manufacturing partners.