Staff Assembly Engineer

Navitas Semiconductor; Muntinlupa; On-site; PHP 400,000 - 700,000; Full time

Job summary

Navitas Semiconductor in Metro Manila is seeking an experienced Process Engineer for semiconductor backend assembly. You will characterize assembly processes, review specs, and work with subcontractors to improve leadframes, BOMs, and tooling while managing NPI risk and on-site progress.

You will lead cross-functional coordination with NPI, Delivery, Quality, and Customer teams, applying FMEA, SPC, and DOE methods to resolve quality and yield issues and ensure smooth production.

Qualifications

• Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering, or related majors.
• Fluent in English (writing and speaking).
• At least 5 years of process engineering experience in a semiconductor backend.
• Experience with Wafer Saw, Laser Groove or DB/WB or EOL assembly.
• FMEA, SPC, Control Plan, OCAP, 8D, MSA; DOE is a plus.

Responsibilities

• Work with subcontractors on Assembly Processes Characterization and risk-based review for new products/packages, with execution and closure.
• Review or generate process specs and obtain review/approval from different teams.
• Collaborate with subcontractors to design and improve leadframe and BOM.
• Coordinate NRE tooling quotes, PO releases and delivery with subcontractors.
• Manage risks in NPIs and monitor on-site progress for critical NPI builds.
• Investigate and resolve quality, yield, and customer return issues; daily sustaining for production.

Skills

Process engineering

English fluency

Risk assessment

Education

Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering

Tools

Wafer Saw

Laser Groove

DB/WB/EOL assembly

FMEA

SPC

Job description

Job Description:

Key Responsibilities And Duties

• Work with subcontractors on Assembly Processes Characterization. Risk base review on New Product/Package Introduced and create evaluation based on the risk identified. Will follow thru execution and closure.
• Review or generate Process specs and other documents, follow up review and approval by different teams within the organization.
• Work with Subcontractors in designing and improving leadframe, BOM.
• Work with Subcontractors on NRE tooling quote, PO release and delivery.
• Manage and prevent risks in running NPI products in assembly, closely monitor and on-site follow up on critical NPI builds.
• Support investigation and resolution of quality, yield and customer return issue. Daily sustaining to smooth the normal production.
• Regular online meeting with cross functional team (NPI, Delivery, Quality and Customer related).
• Lead overall execution locally at Subcon side together with global team.
• Use Project management tool is an advantage to manage NPI activities in subcon from process characterization to assembling Qualification lots to Mass Production Release.

Qualifications

Required Qualifications

Basic

• Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering, or related majors.
• Must be fluent in English in writing and speaking.
• Must have at least 5 years process engineering experience in a Semiconductor backend facility.
• Experienced with Wafer Saw, Laser Groove or DB or WB or EOL Assy. Advantage to have average understanding in the whole Assembly Process.
• Experienced with Engineering Problem Solving Tool like FMEA, SPC, Control plan, OCAP, 8D, MSA. Advantage on expert user on DOE.

Preferred

• Experienced in the whole Assembly Process (from Dicing to Singulation & Tape and Reel)