Assembly Process Engineer

onsemi

Tarlac City

On-site

PHP 600,000 - 900,000

Full time

20 hours ago
Be an early applicant

Get more replies from employers

Send a job-specific resume in minutes.

Job summary

onsemi in the Philippines seeks an Assembly Process Engineer to develop, monitor, and optimize post-wafer manufacturing operations such as wafer dicing, chip packaging, wire bonding, and final testing.

You will troubleshoot defects, improve yield, test new packaging materials, and collaborate with technicians, test engineers, and R&D to launch new package designs while documenting SOPs and material specs.

Qualifications

  • University/College and above in related field.
  • 3+ years of manufacturing experience at Engineer level.
  • Good knowledge in interpersonal communication.
  • Able to lead and motivate subordinates to achieve organizational goals.
  • Able to plan and execute plans effectively.
  • Possesses sound knowledge on relevant company policies and regulations.
  • Effective team building.
  • Possess effective analytical and decision-making skills.

Responsibilities

  • Process Optimization: Fine-tune back-end operations like sawing, flip-chip bonding, die bond, wirebond, molding, and BGA packaging.
  • Yield & Quality Control: Track defect rates using Statistical Process Control (SPC) and failure analysis tools to fix line issues.
  • Experimentation (DOE): Run Design of Experiments to test new materials, tooling changes, or recipe updates.
  • Cross-Functional Support: Work with equipment technicians, test engineers, and R&D teams to launch new package designs.
  • Documentation: Write clear standard operating procedures (SOPs) and material specifications.

Skills

Interpersonal communication
Leadership
Planning & execution
Analytical thinking
Team building
Decision making

Education

University/College and above in related field

Job description

Job Summary

An assembly process engineer develops, monitors, and optimizes post-wafer manufacturing operations—such as wafer dicing, chip packaging, wire bonding, and final testing. They troubleshoot assembly line defects, improve production yield, and test new packaging materials to ensure high reliability and low cost.

Job Description

An assembly process engineer develops, monitors, and optimizes post-wafer manufacturing operations—such as wafer dicing, chip packaging, wire bonding, and final testing. They troubleshoot assembly line defects, improve production yield, and test new packaging materials to ensure high reliability and low cost.

Responsibilities
  • Process Optimization: Fine-tune back-end operations like sawing, flip-chip bonding, die bond, wirebond, molding, and ball grid array (BGA) packaging.
  • Yield & Quality Control: Track defect rates using Statistical Process Control (SPC) and failure analysis tools to fix line issues.
  • Experimentation (DOE): Run Design of Experiments to test new materials, tooling changes, or recipe updates.
  • Cross-Functional Support: Work with equipment technicians, test engineers, and R&D teams to launch new package designs.
  • Documentation: Write clear standard operating procedures (SOPs) and material specifications.
Qualifications
  • University/College and above in related field.
  • 3+ years of manufacturing experience at Engineer level.
  • Good knowledge in interpersonal communication.
  • Able to lead and motivate subordinates to achieve organizational goals.
  • Able to plan and execute plans effectively.
  • Possesses sound knowledge on relevant company policies and regulations.
  • Effective team building.
  • Possess effective analytical and decision-making skills.
About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Process Engineer Section Manager
Process Engineer Section Manager

onsemi • Lapu-Lapu

On-site
PHP 4,810,000 - 6,615,000
Process Engineering Wirebond
Process Engineering Wirebond

onsemi • Lapu-Lapu

On-site
Staff Product & Test Development Engineer
Staff Product & Test Development Engineer

onsemi • Lapu-Lapu

On-site
PHP 1,000,000 - 1,500,000
Sr. Principal Product and Test Development Engineer
Sr. Principal Product and Test Development Engineer

onsemi • Lapu-Lapu

On-site
PHP 4,427,000 - 5,609,000
Competitive salary
Comprehensive health benefits
Career development opportunities
Staff Process Engineer - Mold
Staff Process Engineer - Mold

onsemi • Philippines

On-site
PHP 1,200,000 - 1,500,000
EOL Process Engineer
EOL Process Engineer

onsemi • Lapu-Lapu

On-site
PHP 420,000 - 660,000
Senior Engineer, Process Engineering
Senior Engineer, Process Engineering

OSRAM Opto Semiconductors (Malaysia) Sdn Bhd • Calamba

On-site
PHP 893,000 - 1,116,000
EOL Process Engineer
EOL Process Engineer

Onsemi • Philippines

On-site
Test Process Technician
Test Process Technician

onsemi • Tarlac City

On-site
PHP 240,000 - 360,000
Lead Assembly Process Engineer: Yield & Packaging
Lead Assembly Process Engineer: Yield & Packaging

onsemi • Tarlac City

On-site
PHP 600,000 - 900,000