Senior Engineer, Process Engineering (Assembly)

ams OSRAM; Mimaropa; On-site; PHP 600,000 - 1,200,000; Full time

Job summary

ams OSRAM in the Philippines is seeking an experienced engineer to develop and release work instructions for hermetic assembly, define critical process parameters, and support NPI and qualification runs.

You will own wafer saw/dicing, die attach/bonding, wire/lead bonding, and hermetic sealing processes, ensuring stability, repeatability, and compliance with quality standards across the line. This role requires strong hands-on problem solving and collaboration with QA and operations.

Qualifications

• Bachelor's degree in engineering (Electronics, Mechanical, Materials, or equivalent).
• 3–5 years' experience in semiconductor or electronics assembly.
• Strong experience in wafer saw/dicing, die attach/bonding (eutectic), wire/lead bonding, hermetic sealing.

Responsibilities

• Develop and release work instructions; define critical process parameters and support NPI.
• Own wafer saw/dicing, die attach/bonding, wire/lead bonding, and hermetic sealing processes.
• Monitor production, perform root cause analysis, and implement corrective actions.
• Lead Kaizen, Lean, or Six Sigma projects to improve yield and reduce costs.
• Maintain process flows and train operators; support overseas tech transfer.
• Coordinate with project teams, QA and operations for line readiness and ramp-up.

Skills

Process ownership

Root cause analysis

Lean Six Sigma

Cross-functional collaboration

Education

Bachelor's degree in engineering (Electronics, Mechanical, Materials, or equivalent)

Tools

Wafer saw & dicing

Die attach / bonding (eutectic)

Wire / lead bonding

Hermetic sealing processes

Job description

• Develop and release work instructions based on engineering build requests, define critical process parameters, equipment setup, and material flow for hermetic assembly, and support engineering builds, qualification runs, and new product introductions (NPI)
• Take full ownership of wafer saw/dicing, die attach/die bond, wire/lead bond, and hermetic sealing processes, ensuring stability, repeatability, and compliance with quality and reliability standards
• Monitor daily production performance, conduct root cause analysis on process deviations, implement corrective and preventive actions, and provide hands-on support to resolve line issues quickly
• Drive continuous improvement initiatives to enhance yield, reduce costs, and optimize capacity, leading Kaizen, Lean, or Six Sigma projects, and implementing process optimization opportunities
• Maintain updated process flows, control plans, and work instructions, train and certify operators and technicians on process standards, and support overseas training or technology transfer during line ramp-up
• Collaborate with project teams, QA, and operations to ensure ceramic assembly line readiness, supporting line setup, qualification, and ramp-up toward target production volumes and timelines

• Bachelor's degree in engineering (Electronics, Mechanical, Materials, or equivalent)
• Minimum 3-5 years' experience in semiconductor or electronics assembly
• Strong experience in wafer saw/dicing, die attach/bonding (eutectic), wire/lead bonding, and hermetic sealing processes.

ams OSRAM is an Equal Employment Opportunity Employer. Diversity, equity and inclusion is strongly established in our corporate culture and we firmly believe it makes us more successful as a company. All qualified applications will receive consideration for employment regardless of ethnic, national or social origin, gender, gender identity, sexual orientation, color, religion, age, physical and mental abilities.