Senior Engineer, Process Engineering (Assembly)

Ams Osram; Hinoba-an; On-site; PHP 500,000 - 900,000; Full time

Job summary

ams OSRAM’s Light Sensors & Photonics division seeks an engineer to own hermetic assembly steps, wafer saw/dicing, die attach/bonding and wire/lead bonding while guiding process optimization. The role focuses on stability, repeatability and quality through line support and NPI activities.

You will monitor production, perform root-cause analyses, and drive Kaizen/Lean/Six Sigma initiatives to enhance yield and reduce costs, collaborating with QA and operations to meet ramp-up timelines.

Qualifications

• Bachelor's degree in engineering (Electronics, Mechanical, Materials, or equivalent).
• 3–5 years of semiconductor/electronics assembly experience.
• Extensive experience in wafer saw/dicing, die attach/bonding (eutectic), wire/lead bonding and hermetic sealing.

Responsibilities

• Develop and release work instructions based on engineering build requests, define critical process parameters, equipment setup, and material flow for hermetic assembly, and support engineering builds, qualification runs, and new product introductions (NPI).
• Take full ownership of wafer saw/dicing, die attach/bonding, wire/lead bonding, and hermetic sealing processes, ensuring stability, repeatability, and compliance with quality and reliability standards.
• Monitor daily production performance, conduct root cause analysis on process deviations, implement corrective and preventive actions, and provide hands-on support to resolve line issues quickly.
• Drive continuous improvement initiatives to enhance yield, reduce costs, and optimize capacity, leading Kaizen, Lean, or Six Sigma projects, and implementing process optimization opportunities.
• Maintain updated process flows, control plans, and work instructions, train and certify operators and technicians on process standards, and support overseas training or technology transfer during line ramp-up.
• Collaborate with project teams, QA, and operations to ensure ceramic assembly line readiness, supporting line setup, qualification, and ramp-up toward target production volumes and timelines.

Skills

Process engineering

Root cause analysis

Continuous improvement

Operator training

Cross-functional collaboration

Education

Bachelor's degree in Engineering

Tools

Wafer saw

Die attach/bonding

Wire/lead bonding

Hermetic sealing

Job description

We are LSP - Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing-combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems -driving performance, scalability, and innovation in high-growth segments.

• Develop and release work instructions based on engineering build requests, define critical process parameters, equipment setup, and material flow for hermetic assembly, and support engineering builds, qualification runs, and new product introductions (NPI)
• Take full ownership of wafer saw/dicing, die attach/die bond, wire/lead bond, and hermetic sealing processes, ensuring stability, repeatability, and compliance with quality and reliability standards
• Monitor daily production performance, conduct root cause analysis on process deviations, implement corrective and preventive actions, and provide hands-on support to resolve line issues quickly
• Drive continuous improvement initiatives to enhance yield, reduce costs, and optimize capacity, leading Kaizen, Lean, or Six Sigma projects, and implementing process optimization opportunities
• Maintain updated process flows, control plans, and work instructions, train and certify operators and technicians on process standards, and support overseas training or technology transfer during line ramp-up
• Collaborate with project teams, QA, and operations to ensure ceramic assembly line readiness, supporting line setup, qualification, and ramp-up toward target production volumes and timelines

• Bachelor's degree in engineering (Electronics, Mechanical, Materials, or equivalent)
• Minimum 3-5 years' experience in semiconductor or electronics assembly
• Strong experience in wafer saw/dicing, die attach/bonding (eutectic), wire/lead bonding, and hermetic sealing processes.