Line Leader (FEMALE)

ams Asia Inc.; Calamba; On-site; PHP 279,000 - 446,000; Full time

Job summary

ams Asia Inc. in Laguna is seeking an assembly technician for semiconductor packaging. You will operate equipment for wafer saw and dicing, die attach and wire/lead bond, ensuring hermetic sealing and strict adherence to process WI.

Ideal candidates have 1-3 years in semiconductor or electronics assembly and will participate in CI, line ramp-up training, and cross-site opportunities as required.

Qualifications

• Technical/Vocational course or associate degree in Engineering/Technology preferred.
• 1-3 years' experience in semiconductor or electronics assembly.

Responsibilities

• Operate assembly equipment and perform processes including Wafer Saw / Dicing -> Die Attach / Die Bond -> Wire/Lead Bond. Hermetic Sealing. Follow WI provided by Process Engineer. Handle materials, tools and sensitive components properly.
• Support engineering builds; execute build requests with accuracy and traceability; provide feedback on process issues and improvements; support qualification runs and NPI activities.
• Perform in-process inspections, basic measurements and visual checks; identify defects; escalate issues to Line Leader or Process Engineer; ensure hermetic assembly and quality compliance.
• Monitor machine performance, cycle time and production output; record data; highlight abnormal trends affecting yield or equipment performance.
• Participate in CI activities; suggest improvements related to process flow, ergonomics, and efficiency; assist with corrective actions.
• Perform routine equipment checks and basic preventive maintenance; maintain 5S compliant workspace; ensure safe handling and adherence to EHS standards.
• Participate in training programs, including overseas or cross-site training if required for line ramp-up; develop multi-process capability across steps.

Skills

Wafer Saw / Dicing

Die Attach

Die Bond

Wire Bond

Hermetic Sealing

Education

Technical/Vocational course or associate degree in Engineering/Technology

Job description

Education: Technical/Vocational course or relevant associate degree (Engineering/Technology preferred)

Experience: At least 1-3 year's experience in semiconductor or electronics assembly

Job Description:

• 1. Operate assembly equipment and perform processes including Wafer Saw / Dicing --> Die Attach / Die Bond --> Wire/Lead Bond. Hermetic Sealing. Strictly follow released work instructions (WI) provided by the Process Engineer. Ensure proper handling of materials, tools, and sensitive components.
• 2. Support to Engineering Builds: Execute engineering build requests as instructed, ensuring accuracy and traceability. Provide feedback to the Process Engineer on process issues, abnormalities, and improvement opportunities. Support qualification runs and new product introduction (NPI) activities.
• 3. Quality & Process Compliance: Perform in-process inspections, basic measurements, and visual checks. Identify defects and deviations; escalat*e* issues promptly to the Line Leader or Process Engineer. Ensure compliance with hermetic assembly and quality requirements.
• 4. Process Monitoring & Reporting: Monitor machine performance, cycle time, and production output. Record process data and production results accurately. Highlight any abnormal trends affecting yield or equipment performance.
• 5. Continuous Improvement (CI) Participation: Support continuous improvement activities such as Kaizen initiatives and line optimization. Suggest practical improvements related to process flow, ergonomics, and efficiency. Assist in implementing corrective actions directed by the Process Engineer.
• 6. Equipment Care & Housekeeping: Perform routine equipment checks and basic preventive maintenance tasks. Maintain cleanliness and organization of the work area (5S compliance). Support safe handling practices and adherence to EHS standards.
• 7. Training & Flexibility: Participate in training programs, including overseas or cross-site training if required for line ramp-up. Develop multi-process capability across different assembly steps.