Senior Engineer, Assembly

Poet Technologies Pte Ltd; Santo Niño 1st; On-site; PHP 600,000 - 1,000,000; Full time

Job summary

Poet Technologies Pte Ltd in the Philippines seeks a Senior Engineer, Assembly to support photonics IC packaging R&D. You will handle machine setup, assembly, testing, and process improvements for advanced packaging applications. Collaboration with cross-functional teams will ensure quality and efficient operations.

The role requires hands-on die-assembly, flip-chip, and wire-bonder experience, plus CAD tool familiarity. A degree in engineering and 5+ years in semiconductors are preferred.

Qualifications

• Diploma or Bachelor's Degree in Engineering or related field.
• Minimum 5 years of experience in the semiconductor industry.
• Hands-on experience with die-assembly tools, flip-chip bonders and wire bonders.
• Familiarity with CAD drawing tools is advantageous.
• Knowledge of wafer packaging and photonics packaging processes is a plus.

Responsibilities

• Perform machine setup, calibration, testing, and mechanical assembly of active devices onto interposers.
• Conduct testing on assembled devices and generate detailed test reports and summaries.
• Troubleshoot assembly-related issues and document findings for corrective actions.
• Coordinate with internal teams to manage materials and readiness for assembly operations.
• Analyze packaging process performance including yield, cost, specs, and cycle time.
• Support continuous improvement initiatives to enhance efficiency and quality.
• Maintain documentation of procedures, testing results, and activities.

Skills

Semiconductor experience

Problem solving

Education

Bachelor's Degree in Engineering

Tools

Die-assembly tools

Flip-chip bonder

Wire bonder

CAD drawing tools

Job description

Position Summary

We are seeking a highly motivated Senior Engineer, Assembly to support research and development activities in Photonics IC Packaging. The role involves machine setup, assembly, testing, troubleshooting, and process improvement for advanced photonics packaging applications. The successful candidate will work closely with cross-functional teams to ensure efficient assembly operations, quality performance, and continuous process optimization.

Key Responsibilities

• Perform machine setup, calibration, testing, and mechanical assembly of active devices onto interposers.
• Conduct testing on assembled devices and generate detailed test reports and summaries.
• Troubleshoot assembly-related issues and document findings for failure analysis and corrective actions.
• Coordinate with internal teams to manage incoming materials and ensure readiness for assembly operations.
• Analyze packaging process performance, including yield, manufacturing cost, process specifications, and cycle time.
• Support the planning and execution of continuous improvement initiatives to enhance manufacturing efficiency and product quality.
• Maintain proper documentation of assembly procedures, testing results, and engineering activities.

Requirements

• Diploma, Advanced/Higher/Graduate Diploma, or Bachelor’s Degree in Engineering or a related discipline.
• Minimum 5 years of relevant working experience in the semiconductor industry.
• Hands-on experience with die-assembly tools, flip-chip bonders, and wire bonders is strongly preferred.
• Familiarity with CAD drawing tools is highly advantageous.
• Knowledge of semiconductor wafer packaging and photonics packaging processes is a plus.