Director, Assembly Engineering (Hybrid Integrated Photonics Platform – HIPP)

Poet Technologies Pte Ltd; Santo Niño 1st; On-site; PHP 3,500,000 - 5,500,000; Full time

Job summary

Poet Technologies Pte Ltd seeks a Director, Assembly Engineering to lead the assembly, advanced packaging, and photonics manufacturing strategy from development to high-volume production.

You will partner with R&D, Operations, Quality, Supply Chain, and customers to define roadmaps, scale capabilities, drive operational excellence, and deliver world-class manufacturing performance.

Qualifications

• Advanced engineering leadership experience in semiconductor/photonic manufacturing.
• Experience translating technology strategy into business results.
• Proven ability to manage multimillion-dollar capital investments and global teams.

Responsibilities

• Develop and execute long-term Assembly Engineering strategy aligned with business goals and product commercialization.
• Lead and mentor engineering managers and technical leaders fostering innovation and accountability.
• Oversee manufacturing scale-up and industrialization from NPI to high-volume production.
• Drive KPIs: yield, quality, productivity, cost, cycle time, and equipment utilization.
• Provide executive leadership for advanced assembly technologies (die attach, flip-chip, wafer-level packaging, photonics packaging).
• Champion adoption of new equipment, automation, and materials to sustain competitiveness.
• Lead cross-functional collaboration to ensure successful product transfer and manufacturing scalability.
• Apply data-driven decision making to improve process capability and reduce defects.
• Build partnerships with suppliers and research institutions to accelerate technology adoption.

Skills

Strategic leadership

Executive communication

Capital investment management

Cross-functional collaboration

Manufacturing scale-up

Education

Master's or PhD in Engineering

Job description

Role Overview

The Director, Assembly Engineering provides strategic and organizational leadership for the assembly and advanced packaging engineering function supporting Hybrid Integrated Photonics products. This executive leadership role is accountable for defining the long-term technology roadmap, scaling manufacturing capabilities, driving operational excellence, and enabling successful product commercialization from development through high-volume production. The Director partners closely with executive leadership, R&D, Operations, Quality, Supply Chain, and external technology partners to deliver world-class manufacturing performance, innovation, and business growth.

Key Responsibilities

• Develop and execute the long-term Assembly Engineering strategy aligned with business objectives, technology roadmaps, and product commercialization plans for Hybrid Integrated Photonics.


• Provide organizational leadership by building, mentoring, and developing high-performing engineering managers and technical leaders while fostering a culture of innovation, accountability, continuous improvement, and talent development.


• Lead manufacturing scale-up and industrialization by establishing robust, high-yield, and cost-effective assembly and advanced packaging processes from NPI through high-volume manufacturing.


• Drive operational excellence by owning strategic KPIs including yield, quality, productivity, cost, cycle time, equipment utilization, and overall manufacturing efficiency across the assembly organization.


• Provide executive technical leadership for advanced assembly technologies including die attach, flip-chip bonding, wire bonding, wafer-level processing, photonics packaging, precision alignment, and advanced interconnect solutions.


• Champion technology innovation and capability development through evaluation, qualification, and implementation of next-generation assembly equipment, automation, materials, and manufacturing technologies to maintain industry competitiveness.


• Lead cross-functional collaboration with R&D, Product Engineering, Manufacturing, Supply Chain, Quality, and key customers to ensure successful product transfer, technology readiness, and manufacturing scalability.


• Drive continuous improvement and data-driven decision making by leveraging statistical methodologies and advanced analytics to improve process capability, eliminate defects, optimize costs, and enhance overall manufacturing performance.


• Build strategic partnerships with equipment suppliers, material vendors, research institutions, and external manufacturing partners to accelerate technology adoption, improve supply resilience, and support long-term business growth.


• Represent the Assembly Engineering organization at the executive level by presenting technology strategies, manufacturing performance, investment proposals, risk assessments, and operational roadmaps to senior leadership while ensuring alignment with corporate objectives.

Requirements

• Master's or PhD in Engineering, Materials Science, Physics, Microelectronics, or a related discipline, with 15+ years of progressive experience in semiconductor assembly, advanced packaging, or photonics manufacturing, including 8+ years in senior engineering leadership roles.


• Recognized technical expertise in advanced semiconductor assembly and packaging technologies, including die attach, flip-chip bonding, wire bonding, wafer-level packaging, photonics packaging, precision optical alignment, wafer bumping, eutectic bonding, and advanced interconnect processes.


• Demonstrated success leading large engineering organizations and driving manufacturing transformation, technology commercialization, yield improvement, operational excellence, and global manufacturing scale-up within complex semiconductor or photonics environments.


• Proven executive leadership capabilities with extensive experience influencing cross-functional stakeholders, leading strategic initiatives, managing organizational change, and developing high-performing engineering leadership teams across global operations.


• Exceptional strategic thinking, business acumen, and communication skills, with the ability to translate technology strategy into business results, manage multimillion-dollar capital investments, and effectively engage executive leadership, customers, suppliers, and external partners