Senior Engineer, Photonics Packaging & Assembly

Poet Technologies Pte Ltd; Santo Niño 1st; On-site; PHP 600,000 - 1,000,000; Full time

Job summary

Poet Technologies Pte Ltd in the Philippines seeks a Senior Engineer, Assembly to support photonics IC packaging R&D. You will handle machine setup, assembly, testing, and process improvements for advanced packaging applications. Collaboration with cross-functional teams will ensure quality and efficient operations.

The role requires hands-on die-assembly, flip-chip, and wire-bonder experience, plus CAD tool familiarity. A degree in engineering and 5+ years in semiconductors are preferred.

Qualifications

• Diploma or Bachelor's Degree in Engineering or related field.
• Minimum 5 years of experience in the semiconductor industry.
• Hands-on experience with die-assembly tools, flip-chip bonders and wire bonders.
• Familiarity with CAD drawing tools is advantageous.
• Knowledge of wafer packaging and photonics packaging processes is a plus.

Responsibilities

• Perform machine setup, calibration, testing, and mechanical assembly of active devices onto interposers.
• Conduct testing on assembled devices and generate detailed test reports and summaries.
• Troubleshoot assembly-related issues and document findings for corrective actions.
• Coordinate with internal teams to manage materials and readiness for assembly operations.
• Analyze packaging process performance including yield, cost, specs, and cycle time.
• Support continuous improvement initiatives to enhance efficiency and quality.
• Maintain documentation of procedures, testing results, and activities.

Skills

Semiconductor experience

Problem solving

Education

Bachelor's Degree in Engineering

Tools

Die-assembly tools

Flip-chip bonder

Wire bonder

CAD drawing tools

Job description

Poet Technologies Pte Ltd in the Philippines seeks a Senior Engineer, Assembly to support photonics IC packaging R&D. You will handle machine setup, assembly, testing, and process improvements for advanced packaging applications. Collaboration with cross-functional teams will ensure quality and efficient operations.

The role requires hands-on die-assembly, flip-chip, and wire-bonder experience, plus CAD tool familiarity. A degree in engineering and 5+ years in semiconductors are preferred.