Lead Assembly Process Engineer: Yield & Packaging

onsemi; Tarlac City; On-site; PHP 600,000 - 900,000; Full time

Job summary

onsemi in the Philippines seeks an Assembly Process Engineer to develop, monitor, and optimize post-wafer manufacturing operations such as wafer dicing, chip packaging, wire bonding, and final testing.

You will troubleshoot defects, improve yield, test new packaging materials, and collaborate with technicians, test engineers, and R&D to launch new package designs while documenting SOPs and material specs.

Qualifications

• University/College and above in related field.
• 3+ years of manufacturing experience at Engineer level.
• Good knowledge in interpersonal communication.
• Able to lead and motivate subordinates to achieve organizational goals.
• Able to plan and execute plans effectively.
• Possesses sound knowledge on relevant company policies and regulations.
• Effective team building.
• Possess effective analytical and decision-making skills.

Responsibilities

• Process Optimization: Fine-tune back-end operations like sawing, flip-chip bonding, die bond, wirebond, molding, and BGA packaging.
• Yield & Quality Control: Track defect rates using Statistical Process Control (SPC) and failure analysis tools to fix line issues.
• Experimentation (DOE): Run Design of Experiments to test new materials, tooling changes, or recipe updates.
• Cross-Functional Support: Work with equipment technicians, test engineers, and R&D teams to launch new package designs.
• Documentation: Write clear standard operating procedures (SOPs) and material specifications.

Skills

Interpersonal communication

Leadership

Planning & execution

Analytical thinking

Team building

Decision making

Education

University/College and above in related field

Job description

onsemi in the Philippines seeks an Assembly Process Engineer to develop, monitor, and optimize post-wafer manufacturing operations such as wafer dicing, chip packaging, wire bonding, and final testing.

You will troubleshoot defects, improve yield, test new packaging materials, and collaborate with technicians, test engineers, and R&D to launch new package designs while documenting SOPs and material specs.